Method of planarizing a curved substrate and resulting structure

According to the present invention a technique for providing a planarized substrate with dendritic connections of solder balls, especially a multi-layer ceramic substrate is provided. In the case where the substrate has a raised central portion on the top surface on which are disposed top surface me...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	DOWNES, JR., FRANCIS JOSEPH, FUERNISS, STEPHEN JOSEPH, HILL, GARY RAY, MOLLA, JAYNAL ABEDIN, INGRAHAM, ANTHONY PAUL, MARKOVICH, VOYA RISTA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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