Wiring board with an insulating layer to prevent gap formation during etching

A wiring board structure includes a board made of a material which can be etched by a given solution, an electrically conductive portion, which is thermally conductive, having a portion which extends from the board and which can be etched by the given solution, and an insulating layer having a porti...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	OTAGURO, HIROYUKI, YOKEMURA, HITOSHI, HIGASHIGUCHI, YUTAKA, HIDA, MASAHARU, HOSOGAI, MASAO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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