Interconnect structure for joining a chip to a circuit card

A solder interconnection uses preferably lead-rich balls for making a low temperature chip attachment directly to any of the higher levels of packaging substrate. After a solder ball has been formed using standard processes, a ball limiting metal mask is formed using photoresist. A thin cap layer of...

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Hauptverfasser:	BOYKO, CHRISTINA M, MARKOVICH, VOYA R, RUSSELL, DAVID J, INGRAHAM, ANTHONY P
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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creator	BOYKO CHRISTINA M MARKOVICH VOYA R RUSSELL DAVID J INGRAHAM ANTHONY P
description	A solder interconnection uses preferably lead-rich balls for making a low temperature chip attachment directly to any of the higher levels of packaging substrate. After a solder ball has been formed using standard processes, a ball limiting metal mask is formed using photoresist. A thin cap layer of preferably pure tin is deposited on a surface of the solder balls using a tin aqueous immersion process.
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subjects	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
title	Interconnect structure for joining a chip to a circuit card
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