Method for increasing power supply bypassing while decreasing chip layer density variations

A method for increasing the layer density uniformity across a conductive layer, which comprises a plurality of functional blocks, of an integrated circuit is presented. Increased uniformity is achieved by tiling a plurality of capacitors in between the functional blocks. The configuration of the cap...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	NUBER, PAUL D, WELCH, M. JASON, HUMPHREY, GUY H, DONDALE, C. STEPHEN, STOTZ, DAN, CLARKE, STEPHEN E
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!