Apparatus to monitor and add plating solution of plating baths and controlling quality of deposited metal

An apparatus for monitoring and adding solution to a plating bath and controlling the quality of deposited metal. At least one monitor monitors at least one condition within a plating bath and produces at least one signal corresponding to the at least one condition. At least one controller receives...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ANDRICACOS, PANAYOTIS CONSTANTINOU, HORKANS, WILMA JEAN, UZOH, CYPRIAN EMEKA
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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