Corrosion sensitivity structures for vias and contact holes in integrated circuits

A die including a corrosion monitoring feature is described. The die includes: (i) a surface including an active die region and a scribeline region that is adjacent the active die region; (ii) an insulating layer disposed above the surface and includes a first corrosion sensitive metal plug and a se...

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Bibliographische Detailangaben
Hauptverfasser: SUGASAWARA, EMERY O, ESSES, DONALD J
Format: Patent
Sprache:eng
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