Heat-dissipating structure of an electronic part

A heat-dissipating structure in which a cylindrical projecting portion is formed in a shield case so as to project inwardly of the shield case and contact an electronic part encased in the shield case. This heat-dissipating structure has high heat conductivity and can reduce the amount of interferin...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ONISHI, YUKIHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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