Low dielectric constant composite film for integrated circuits of an inorganic aerogel and an organic filler grafted to the inorganic material and method of fabrication

An insulating film between stacked electrically conducting layers through which interconnections of integrated circuits are realized, is formed of an aerogel of an inorganic oxide on which organic monomers have been grafted under inert ion bombardment and successively further incorporated in the aer...

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Bibliographische Detailangaben
Hauptverfasser: DE SANTI, GIORGIO, CEROFOLINI, GIANFRANCO, CRISENZA, GIUSEPPE
Format: Patent
Sprache:eng
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