Zincate catalysis electroless metal deposition for via metal interconnection

A method of forming an interconnect or metal line in a semiconductor device using an zinc activated metal surface and electroless deposition. The invention forms an active metal layer (e.g., Al) layer on an insulating layer in a via hole, activates the active metal layer to form a Zn layer, and elec...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KE, CHIH-MING, SHEN, YUN-HUNG, CHANG, JIEH-TING
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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