Method for patterning integrated circuit conductors

A method for forming integrated circuit conductors. The method includes the steps of placing in a reactive ion etching chamber a semiconductor body having disposed over a surface thereof: a metalization layer comprising an aluminum layer disposed between a pair of barrier metal layers; and, a photor...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SPULER, BRUNO, GREWAL, VIRINDER
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!