Reworkability solution for wirebound chips using high performance capacitor

A device and method for enabling the reworkability of an integrated circuit. The device includes a wirebond chip having a bottom surface and a carrier substrate having a first surface and a second surface. The first surface and second surface of the carrier substrate are electrically connected throu...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	RAY, SUDIPTA KUMAR, FAROOQ, MUKTA SHAJI, JACKSON, RAYMOND ALAN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS SEMICONDUCTOR DEVICES TESTING
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