Multilevel interconnect structure for integrated circuits

A multilevel interconnect structure includes a lower conducting layer, a dielectric layer formed on the lower conducting layer, an upper conducting layer formed partly on the dielectric layer, and an I-shaped via plug for electrically connecting the lower conducting layer and the upper conducting la...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HSING, EDWARD HSIEN-SHENG, HONG, JEN-DER
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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