Method of joining a cover material to a substrate utilizing electrically conductive bonding

The method of producing a cushion assembly includes bonding a foam pad to a cover material with a heat-activatable adhesive layer and an electrically conductive layer therebetween. The cover material is placed in a contoured mold with the adhesive layer and the electrically conductive layer placed t...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: PARRISH, KENNETH R, GINMAN, CHARLES D
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!