Method of joining a cover material to a substrate utilizing electrically conductive bonding
The method of producing a cushion assembly includes bonding a foam pad to a cover material with a heat-activatable adhesive layer and an electrically conductive layer therebetween. The cover material is placed in a contoured mold with the adhesive layer and the electrically conductive layer placed t...
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| creator | PARRISH KENNETH R GINMAN CHARLES D |
| description | The method of producing a cushion assembly includes bonding a foam pad to a cover material with a heat-activatable adhesive layer and an electrically conductive layer therebetween. The cover material is placed in a contoured mold with the adhesive layer and the electrically conductive layer placed thereover and in heat transfer relationship to each other. The foam pad is placed thereover and the electrically conductive layer is energized to heat and activate the heat-activatable adhesive layer to allow bonding between the foam pad, the cover material and the electrically conductive layer. |
| format | Patent |
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The cover material is placed in a contoured mold with the adhesive layer and the electrically conductive layer placed thereover and in heat transfer relationship to each other. The foam pad is placed thereover and the electrically conductive layer is energized to heat and activate the heat-activatable adhesive layer to allow bonding between the foam pad, the cover material and the electrically conductive layer.</description><edition>6</edition><language>eng</language><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING ; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC ; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS ; INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES ; MAKING GRANULES OR PREFORMS ; PERFORMING OPERATIONS ; PREPARATION OR PRETREATMENT OF THE MATERIAL TO BESHAPED ; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIALCONTAINING PLASTICS ; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR ; SHAPING OR JOINING OF PLASTICS ; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ; TECHNICAL SUBJECTS COVERED BY FORMER USPC ; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS ; TRANSPORTING ; WORKING OF PLASTICS ; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><creationdate>1999</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19991221&DB=EPODOC&CC=US&NR=6004418A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19991221&DB=EPODOC&CC=US&NR=6004418A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>PARRISH; KENNETH R</creatorcontrib><creatorcontrib>GINMAN; CHARLES D</creatorcontrib><title>Method of joining a cover material to a substrate utilizing electrically conductive bonding</title><description>The method of producing a cushion assembly includes bonding a foam pad to a cover material with a heat-activatable adhesive layer and an electrically conductive layer therebetween. The cover material is placed in a contoured mold with the adhesive layer and the electrically conductive layer placed thereover and in heat transfer relationship to each other. The foam pad is placed thereover and the electrically conductive layer is energized to heat and activate the heat-activatable adhesive layer to allow bonding between the foam pad, the cover material and the electrically conductive layer.</description><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</subject><subject>GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC</subject><subject>GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS</subject><subject>INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES</subject><subject>MAKING GRANULES OR PREFORMS</subject><subject>PERFORMING OPERATIONS</subject><subject>PREPARATION OR PRETREATMENT OF THE MATERIAL TO BESHAPED</subject><subject>RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIALCONTAINING PLASTICS</subject><subject>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</subject><subject>SHAPING OR JOINING OF PLASTICS</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER USPC</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</subject><subject>TRANSPORTING</subject><subject>WORKING OF PLASTICS</subject><subject>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1999</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqFi7EKwkAQRK-xEPUb3B8QIgaxFVFsrNTKImwum7iy3oW7vYB-vSfYW83w5s3Y3E6kd9-Ab-Hh2bHrAMH6gQI8USkwCqjPLKY6asgIkrLw-2uSkNXAFkVe-eSaZJUHgjrXvE_NqEWJNPvlxMwP-8vuuKDeVxR7tORIq-t5XRRludxsV_-ND5jkOx8</recordid><startdate>19991221</startdate><enddate>19991221</enddate><creator>PARRISH; KENNETH R</creator><creator>GINMAN; CHARLES D</creator><scope>EVB</scope></search><sort><creationdate>19991221</creationdate><title>Method of joining a cover material to a substrate utilizing electrically conductive bonding</title><author>PARRISH; KENNETH R ; GINMAN; CHARLES D</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US6004418A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1999</creationdate><topic>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</topic><topic>GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC</topic><topic>GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS</topic><topic>INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES</topic><topic>MAKING GRANULES OR PREFORMS</topic><topic>PERFORMING OPERATIONS</topic><topic>PREPARATION OR PRETREATMENT OF THE MATERIAL TO BESHAPED</topic><topic>RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIALCONTAINING PLASTICS</topic><topic>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</topic><topic>SHAPING OR JOINING OF PLASTICS</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER USPC</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</topic><topic>TRANSPORTING</topic><topic>WORKING OF PLASTICS</topic><topic>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</topic><toplevel>online_resources</toplevel><creatorcontrib>PARRISH; KENNETH R</creatorcontrib><creatorcontrib>GINMAN; CHARLES D</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>PARRISH; KENNETH R</au><au>GINMAN; CHARLES D</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method of joining a cover material to a substrate utilizing electrically conductive bonding</title><date>1999-12-21</date><risdate>1999</risdate><abstract>The method of producing a cushion assembly includes bonding a foam pad to a cover material with a heat-activatable adhesive layer and an electrically conductive layer therebetween. The cover material is placed in a contoured mold with the adhesive layer and the electrically conductive layer placed thereover and in heat transfer relationship to each other. The foam pad is placed thereover and the electrically conductive layer is energized to heat and activate the heat-activatable adhesive layer to allow bonding between the foam pad, the cover material and the electrically conductive layer.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record> |
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| subjects | AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES MAKING GRANULES OR PREFORMS PERFORMING OPERATIONS PREPARATION OR PRETREATMENT OF THE MATERIAL TO BESHAPED RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIALCONTAINING PLASTICS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL |
| title | Method of joining a cover material to a substrate utilizing electrically conductive bonding |
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