Vacuum pull down method for an enhanced bonding process

A process for effectively bonding arbitrary size or shape substrates. The process incorporates vacuum pull down techniques to ensure uniform surface contact during the bonding process. The essence of the process for bonding substrates, such as glass, plastic, or alloys, etc., which have a moderate m...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	DAVIDSON, JAMES C, BALCH, JOSEPH W
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY GLASS MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES METALLURGY MINERAL OR SLAG WOOL
Online-Zugang:	Volltext bestellen
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