Continuous Flexible chemically-milled circuit assembly with multiple conductor layers and method of making same
A method of manufacturing an improved multi-layer printed circuit assembly having at least two conductor patterns. The method includes providing a first layer having a first metal surface a second layer having a second metal surface. A thin flexible carrier is placed between the first and second lay...
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creator | BELKE, JR. ROBERT EDWARD MCLESKEY EDWARD P ZITZMANN ALICE DAWN TRUBLOWSKI JOHN |
description | A method of manufacturing an improved multi-layer printed circuit assembly having at least two conductor patterns. The method includes providing a first layer having a first metal surface a second layer having a second metal surface. A thin flexible carrier is placed between the first and second layers. The first and second layers are attached to opposite surfaces of the carrier. The first and second metal surfaces are etched to form first and second conductor patterns. The conductor patterns form the electrical traces interconnecting components on an electronic circuit assembly. The first and second conductor patterns are electrically connected to form an electronic circuit assembly that includes electronic traces on both sides of the circuit board. |
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subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS |
title | Continuous Flexible chemically-milled circuit assembly with multiple conductor layers and method of making same |
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