Continuous Flexible chemically-milled circuit assembly with multiple conductor layers and method of making same

A method of manufacturing an improved multi-layer printed circuit assembly having at least two conductor patterns. The method includes providing a first layer having a first metal surface a second layer having a second metal surface. A thin flexible carrier is placed between the first and second lay...

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Hauptverfasser: BELKE, JR., ROBERT EDWARD, MCLESKEY, EDWARD P, ZITZMANN, ALICE DAWN, TRUBLOWSKI, JOHN
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Sprache:eng
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creator BELKE, JR.
ROBERT EDWARD
MCLESKEY
EDWARD P
ZITZMANN
ALICE DAWN
TRUBLOWSKI
JOHN
description A method of manufacturing an improved multi-layer printed circuit assembly having at least two conductor patterns. The method includes providing a first layer having a first metal surface a second layer having a second metal surface. A thin flexible carrier is placed between the first and second layers. The first and second layers are attached to opposite surfaces of the carrier. The first and second metal surfaces are etched to form first and second conductor patterns. The conductor patterns form the electrical traces interconnecting components on an electronic circuit assembly. The first and second conductor patterns are electrically connected to form an electronic circuit assembly that includes electronic traces on both sides of the circuit board.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US5976391A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US5976391A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US5976391A3</originalsourceid><addsrcrecordid>eNqFy7EKwjAQgOEuDqI-g_cCHaSodJRicVfnck2u5vCSK02C9u1FcHf6l-9fFtpoSByy5git0Jt7ITCOPBsUmUvPImTB8GQyJ8AYyfcyw4uTA58l8fgdNNhskk4gONMUAYMFT8mpBR3A45PDAyJ6WheLASXS5tdVsW3Pt-ZS0qgdxRENBUrd_bqvj4eq3p2q_-IDgSlDEw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Continuous Flexible chemically-milled circuit assembly with multiple conductor layers and method of making same</title><source>esp@cenet</source><creator>BELKE, JR.; ROBERT EDWARD ; MCLESKEY; EDWARD P ; ZITZMANN; ALICE DAWN ; TRUBLOWSKI; JOHN</creator><creatorcontrib>BELKE, JR.; ROBERT EDWARD ; MCLESKEY; EDWARD P ; ZITZMANN; ALICE DAWN ; TRUBLOWSKI; JOHN</creatorcontrib><description>A method of manufacturing an improved multi-layer printed circuit assembly having at least two conductor patterns. The method includes providing a first layer having a first metal surface a second layer having a second metal surface. A thin flexible carrier is placed between the first and second layers. The first and second layers are attached to opposite surfaces of the carrier. The first and second metal surfaces are etched to form first and second conductor patterns. The conductor patterns form the electrical traces interconnecting components on an electronic circuit assembly. The first and second conductor patterns are electrically connected to form an electronic circuit assembly that includes electronic traces on both sides of the circuit board.</description><edition>6</edition><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC ; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ; TECHNICAL SUBJECTS COVERED BY FORMER USPC ; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</subject><creationdate>1999</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19991102&amp;DB=EPODOC&amp;CC=US&amp;NR=5976391A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19991102&amp;DB=EPODOC&amp;CC=US&amp;NR=5976391A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>BELKE, JR.; ROBERT EDWARD</creatorcontrib><creatorcontrib>MCLESKEY; EDWARD P</creatorcontrib><creatorcontrib>ZITZMANN; ALICE DAWN</creatorcontrib><creatorcontrib>TRUBLOWSKI; JOHN</creatorcontrib><title>Continuous Flexible chemically-milled circuit assembly with multiple conductor layers and method of making same</title><description>A method of manufacturing an improved multi-layer printed circuit assembly having at least two conductor patterns. The method includes providing a first layer having a first metal surface a second layer having a second metal surface. A thin flexible carrier is placed between the first and second layers. The first and second layers are attached to opposite surfaces of the carrier. The first and second metal surfaces are etched to form first and second conductor patterns. The conductor patterns form the electrical traces interconnecting components on an electronic circuit assembly. The first and second conductor patterns are electrically connected to form an electronic circuit assembly that includes electronic traces on both sides of the circuit board.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC</subject><subject>GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER USPC</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1999</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqFy7EKwjAQgOEuDqI-g_cCHaSodJRicVfnck2u5vCSK02C9u1FcHf6l-9fFtpoSByy5git0Jt7ITCOPBsUmUvPImTB8GQyJ8AYyfcyw4uTA58l8fgdNNhskk4gONMUAYMFT8mpBR3A45PDAyJ6WheLASXS5tdVsW3Pt-ZS0qgdxRENBUrd_bqvj4eq3p2q_-IDgSlDEw</recordid><startdate>19991102</startdate><enddate>19991102</enddate><creator>BELKE, JR.; ROBERT EDWARD</creator><creator>MCLESKEY; EDWARD P</creator><creator>ZITZMANN; ALICE DAWN</creator><creator>TRUBLOWSKI; JOHN</creator><scope>EVB</scope></search><sort><creationdate>19991102</creationdate><title>Continuous Flexible chemically-milled circuit assembly with multiple conductor layers and method of making same</title><author>BELKE, JR.; ROBERT EDWARD ; MCLESKEY; EDWARD P ; ZITZMANN; ALICE DAWN ; TRUBLOWSKI; JOHN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US5976391A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1999</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC</topic><topic>GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER USPC</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</topic><toplevel>online_resources</toplevel><creatorcontrib>BELKE, JR.; ROBERT EDWARD</creatorcontrib><creatorcontrib>MCLESKEY; EDWARD P</creatorcontrib><creatorcontrib>ZITZMANN; ALICE DAWN</creatorcontrib><creatorcontrib>TRUBLOWSKI; JOHN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>BELKE, JR.; ROBERT EDWARD</au><au>MCLESKEY; EDWARD P</au><au>ZITZMANN; ALICE DAWN</au><au>TRUBLOWSKI; JOHN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Continuous Flexible chemically-milled circuit assembly with multiple conductor layers and method of making same</title><date>1999-11-02</date><risdate>1999</risdate><abstract>A method of manufacturing an improved multi-layer printed circuit assembly having at least two conductor patterns. The method includes providing a first layer having a first metal surface a second layer having a second metal surface. A thin flexible carrier is placed between the first and second layers. The first and second layers are attached to opposite surfaces of the carrier. The first and second metal surfaces are etched to form first and second conductor patterns. The conductor patterns form the electrical traces interconnecting components on an electronic circuit assembly. The first and second conductor patterns are electrically connected to form an electronic circuit assembly that includes electronic traces on both sides of the circuit board.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record>
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source esp@cenet
subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
TECHNICAL SUBJECTS COVERED BY FORMER USPC
TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
title Continuous Flexible chemically-milled circuit assembly with multiple conductor layers and method of making same
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-29T08%3A17%3A25IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=BELKE,%20JR.;%20ROBERT%20EDWARD&rft.date=1999-11-02&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS5976391A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true