Low profile clamping mechanism for connecting a printed circuit board to a flexible printed circuit

A clamping mechanism (10) for connecting a printed circuit board (12) having a plurality of electrically conductive pads (14) to a flexible printed circuit having a plurality of electrically conductive raised dots (18). A housing (20) having a mouth (22) is located upon the printed circuit board at...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: BENZE, EVERETT LACY, SZALAY, JOHN STEVEN, WANG, TERRY SHING
Format: Patent
Sprache:eng
Schlagworte:
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