Method for flat firing aluminum nitride/tungsten electronic modules
A method and apparatus for flattening a ceramic body comprised primarily of an aluminum nitride system having a liquid phase additive necessary for low temperature sintering during a firing thereof is disclosed. The ceramic body is referred to as an aluminum nitride multilayer ceramic (AlN MLC). The...
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| creator | SHINDE SUBHASH LAXMAN JOHNSON GREGORY MARVIN FASANO BENJAMIN VITO HANNON ROBERT REITTER ANDREW MICHAEL CORDERO CARLA NATALIA BATES RICHARD ALLEN STUDZINSKI LISA MICHELLE GOLAND DAVID BRIAN HERRON LESTER WYNN |
| description | A method and apparatus for flattening a ceramic body comprised primarily of an aluminum nitride system having a liquid phase additive necessary for low temperature sintering during a firing thereof is disclosed. The ceramic body is referred to as an aluminum nitride multilayer ceramic (AlN MLC). The method and apparatus include a support tile having a first coating on a contact surface thereof, the AlN MLC for being placed upon the contact surface of the support tile. A load flattening tile having a second coating on a contact surface thereof is provided, the load flattening tile for being placed with its coated surface upon and in contact with the AlN MLC. Lastly, a furnace is provided for heating the support tile, AlN MLC, and load flattening tile at temperatures greater than 1500 DEG C. for an amount of time necessary to flatten the ceramic body to a desired degree of flatness, wherein the first coating and the second coating of the support tile and the load flattening tile, respectively, react with the AlN MLC for quenching the liquid phase of the ceramic body to prevent a sticking of the support tile and the load flattening tile to the AlN MLC during a flattening process. |
| format | Patent |
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The ceramic body is referred to as an aluminum nitride multilayer ceramic (AlN MLC). The method and apparatus include a support tile having a first coating on a contact surface thereof, the AlN MLC for being placed upon the contact surface of the support tile. A load flattening tile having a second coating on a contact surface thereof is provided, the load flattening tile for being placed with its coated surface upon and in contact with the AlN MLC. Lastly, a furnace is provided for heating the support tile, AlN MLC, and load flattening tile at temperatures greater than 1500 DEG C. for an amount of time necessary to flatten the ceramic body to a desired degree of flatness, wherein the first coating and the second coating of the support tile and the load flattening tile, respectively, react with the AlN MLC for quenching the liquid phase of the ceramic body to prevent a sticking of the support tile and the load flattening tile to the AlN MLC during a flattening process.</description><edition>6</edition><language>eng</language><subject>ARTIFICIAL STONE ; BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CEMENTS ; CERAMICS ; CHEMISTRY ; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS ; CONCRETE ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; LIME, MAGNESIA ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; PRINTED CIRCUITS ; REFRACTORIES ; SEMICONDUCTOR DEVICES ; SLAG ; TREATMENT OF NATURAL STONE</subject><creationdate>1999</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19990803&DB=EPODOC&CC=US&NR=5932043A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19990803&DB=EPODOC&CC=US&NR=5932043A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SHINDE; SUBHASH LAXMAN</creatorcontrib><creatorcontrib>JOHNSON; GREGORY MARVIN</creatorcontrib><creatorcontrib>FASANO; BENJAMIN VITO</creatorcontrib><creatorcontrib>HANNON; ROBERT</creatorcontrib><creatorcontrib>REITTER; ANDREW MICHAEL</creatorcontrib><creatorcontrib>CORDERO; CARLA NATALIA</creatorcontrib><creatorcontrib>BATES; RICHARD ALLEN</creatorcontrib><creatorcontrib>STUDZINSKI; LISA MICHELLE</creatorcontrib><creatorcontrib>GOLAND; DAVID BRIAN</creatorcontrib><creatorcontrib>HERRON; LESTER WYNN</creatorcontrib><title>Method for flat firing aluminum nitride/tungsten electronic modules</title><description>A method and apparatus for flattening a ceramic body comprised primarily of an aluminum nitride system having a liquid phase additive necessary for low temperature sintering during a firing thereof is disclosed. The ceramic body is referred to as an aluminum nitride multilayer ceramic (AlN MLC). The method and apparatus include a support tile having a first coating on a contact surface thereof, the AlN MLC for being placed upon the contact surface of the support tile. A load flattening tile having a second coating on a contact surface thereof is provided, the load flattening tile for being placed with its coated surface upon and in contact with the AlN MLC. Lastly, a furnace is provided for heating the support tile, AlN MLC, and load flattening tile at temperatures greater than 1500 DEG C. for an amount of time necessary to flatten the ceramic body to a desired degree of flatness, wherein the first coating and the second coating of the support tile and the load flattening tile, respectively, react with the AlN MLC for quenching the liquid phase of the ceramic body to prevent a sticking of the support tile and the load flattening tile to the AlN MLC during a flattening process.</description><subject>ARTIFICIAL STONE</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CEMENTS</subject><subject>CERAMICS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS</subject><subject>CONCRETE</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>LIME, MAGNESIA</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>PRINTED CIRCUITS</subject><subject>REFRACTORIES</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SLAG</subject><subject>TREATMENT OF NATURAL STONE</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1999</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqFyiEOAjEQBdA1CAKcgbkAgVAQSLKBYFCA3jTt7-4k7XTTTu-PwaOeecuuf0Kn7CnkQiFapcCFZSQbW2JpiYS1sMdem4xVIYQIpyULO0rZt4i67hbBxorNz1W3vd_e_WOHOQ-os3UQ6PB5nS_meDiZq_k_vu5mMlU</recordid><startdate>19990803</startdate><enddate>19990803</enddate><creator>SHINDE; SUBHASH LAXMAN</creator><creator>JOHNSON; GREGORY MARVIN</creator><creator>FASANO; BENJAMIN VITO</creator><creator>HANNON; ROBERT</creator><creator>REITTER; ANDREW MICHAEL</creator><creator>CORDERO; CARLA NATALIA</creator><creator>BATES; RICHARD ALLEN</creator><creator>STUDZINSKI; LISA MICHELLE</creator><creator>GOLAND; DAVID BRIAN</creator><creator>HERRON; LESTER WYNN</creator><scope>EVB</scope></search><sort><creationdate>19990803</creationdate><title>Method for flat firing aluminum nitride/tungsten electronic modules</title><author>SHINDE; SUBHASH LAXMAN ; JOHNSON; GREGORY MARVIN ; FASANO; BENJAMIN VITO ; HANNON; ROBERT ; REITTER; ANDREW MICHAEL ; CORDERO; CARLA NATALIA ; BATES; RICHARD ALLEN ; STUDZINSKI; LISA MICHELLE ; GOLAND; DAVID BRIAN ; HERRON; LESTER WYNN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US5932043A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1999</creationdate><topic>ARTIFICIAL STONE</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CEMENTS</topic><topic>CERAMICS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS</topic><topic>CONCRETE</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>LIME, MAGNESIA</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>PRINTED CIRCUITS</topic><topic>REFRACTORIES</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SLAG</topic><topic>TREATMENT OF NATURAL STONE</topic><toplevel>online_resources</toplevel><creatorcontrib>SHINDE; SUBHASH LAXMAN</creatorcontrib><creatorcontrib>JOHNSON; GREGORY MARVIN</creatorcontrib><creatorcontrib>FASANO; BENJAMIN VITO</creatorcontrib><creatorcontrib>HANNON; ROBERT</creatorcontrib><creatorcontrib>REITTER; ANDREW MICHAEL</creatorcontrib><creatorcontrib>CORDERO; CARLA NATALIA</creatorcontrib><creatorcontrib>BATES; RICHARD ALLEN</creatorcontrib><creatorcontrib>STUDZINSKI; LISA MICHELLE</creatorcontrib><creatorcontrib>GOLAND; DAVID BRIAN</creatorcontrib><creatorcontrib>HERRON; LESTER WYNN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SHINDE; SUBHASH LAXMAN</au><au>JOHNSON; GREGORY MARVIN</au><au>FASANO; BENJAMIN VITO</au><au>HANNON; ROBERT</au><au>REITTER; ANDREW MICHAEL</au><au>CORDERO; CARLA NATALIA</au><au>BATES; RICHARD ALLEN</au><au>STUDZINSKI; LISA MICHELLE</au><au>GOLAND; DAVID BRIAN</au><au>HERRON; LESTER WYNN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method for flat firing aluminum nitride/tungsten electronic modules</title><date>1999-08-03</date><risdate>1999</risdate><abstract>A method and apparatus for flattening a ceramic body comprised primarily of an aluminum nitride system having a liquid phase additive necessary for low temperature sintering during a firing thereof is disclosed. The ceramic body is referred to as an aluminum nitride multilayer ceramic (AlN MLC). The method and apparatus include a support tile having a first coating on a contact surface thereof, the AlN MLC for being placed upon the contact surface of the support tile. A load flattening tile having a second coating on a contact surface thereof is provided, the load flattening tile for being placed with its coated surface upon and in contact with the AlN MLC. Lastly, a furnace is provided for heating the support tile, AlN MLC, and load flattening tile at temperatures greater than 1500 DEG C. for an amount of time necessary to flatten the ceramic body to a desired degree of flatness, wherein the first coating and the second coating of the support tile and the load flattening tile, respectively, react with the AlN MLC for quenching the liquid phase of the ceramic body to prevent a sticking of the support tile and the load flattening tile to the AlN MLC during a flattening process.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record> |
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| subjects | ARTIFICIAL STONE BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CEMENTS CERAMICS CHEMISTRY COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS CONCRETE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LIME, MAGNESIA MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS REFRACTORIES SEMICONDUCTOR DEVICES SLAG TREATMENT OF NATURAL STONE |
| title | Method for flat firing aluminum nitride/tungsten electronic modules |
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