Process for via fill
An apparatus and method is provided for vacuum screen printing a greensheet having vias and both vias and open areas whereby vacuum leakage in the apparatus is minimized and avoids bowing of the screen over the open area of the greensheet. An interposer apparatus is provided comprising at least two...
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creator | O'NEIL KEITH C POMERANTZ GLENN A CASEY JON A PETERSON BRENDA L MACKIN DANIEL S BALZ JAMES G CALLI CYNTHIA J LONG DAVID C |
description | An apparatus and method is provided for vacuum screen printing a greensheet having vias and both vias and open areas whereby vacuum leakage in the apparatus is minimized and avoids bowing of the screen over the open area of the greensheet. An interposer apparatus is provided comprising at least two layers having vertical through openings in registration with the via openings of the greensheet and screen. The interposer also comprises vertical through openings communicating with the open area of the greensheet and with vent channels of the interposer. A porous membrane is also used either alone or in conjunction with the interposer to provide enhanced screening results. |
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fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US5927193A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US5927193A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US5927193A3</originalsourceid><addsrcrecordid>eNrjZBAJKMpPTi0uVkjLL1Ioy0xUSMvMyeFhYE1LzClO5YXS3Azybq4hzh66qQX58anFBYnJqXmpJfGhwaaWRuaGlsaOxoRVAAC4kR_a</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Process for via fill</title><source>esp@cenet</source><creator>O'NEIL; KEITH C ; POMERANTZ; GLENN A ; CASEY; JON A ; PETERSON; BRENDA L ; MACKIN; DANIEL S ; BALZ; JAMES G ; CALLI; CYNTHIA J ; LONG; DAVID C</creator><creatorcontrib>O'NEIL; KEITH C ; POMERANTZ; GLENN A ; CASEY; JON A ; PETERSON; BRENDA L ; MACKIN; DANIEL S ; BALZ; JAMES G ; CALLI; CYNTHIA J ; LONG; DAVID C</creatorcontrib><description>An apparatus and method is provided for vacuum screen printing a greensheet having vias and both vias and open areas whereby vacuum leakage in the apparatus is minimized and avoids bowing of the screen over the open area of the greensheet. An interposer apparatus is provided comprising at least two layers having vertical through openings in registration with the via openings of the greensheet and screen. The interposer also comprises vertical through openings communicating with the open area of the greensheet and with vent channels of the interposer. A porous membrane is also used either alone or in conjunction with the interposer to provide enhanced screening results.</description><edition>6</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; COLOUR PRINTING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; LINING MACHINES ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; PRINTING ; PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES ; SEMICONDUCTOR DEVICES ; STAMPS ; TRANSPORTING ; TYPEWRITERS</subject><creationdate>1999</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19990727&DB=EPODOC&CC=US&NR=5927193A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76418</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19990727&DB=EPODOC&CC=US&NR=5927193A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>O'NEIL; KEITH C</creatorcontrib><creatorcontrib>POMERANTZ; GLENN A</creatorcontrib><creatorcontrib>CASEY; JON A</creatorcontrib><creatorcontrib>PETERSON; BRENDA L</creatorcontrib><creatorcontrib>MACKIN; DANIEL S</creatorcontrib><creatorcontrib>BALZ; JAMES G</creatorcontrib><creatorcontrib>CALLI; CYNTHIA J</creatorcontrib><creatorcontrib>LONG; DAVID C</creatorcontrib><title>Process for via fill</title><description>An apparatus and method is provided for vacuum screen printing a greensheet having vias and both vias and open areas whereby vacuum leakage in the apparatus is minimized and avoids bowing of the screen over the open area of the greensheet. An interposer apparatus is provided comprising at least two layers having vertical through openings in registration with the via openings of the greensheet and screen. The interposer also comprises vertical through openings communicating with the open area of the greensheet and with vent channels of the interposer. A porous membrane is also used either alone or in conjunction with the interposer to provide enhanced screening results.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>COLOUR PRINTING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>LINING MACHINES</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>PRINTING</subject><subject>PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>STAMPS</subject><subject>TRANSPORTING</subject><subject>TYPEWRITERS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1999</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBAJKMpPTi0uVkjLL1Ioy0xUSMvMyeFhYE1LzClO5YXS3Azybq4hzh66qQX58anFBYnJqXmpJfGhwaaWRuaGlsaOxoRVAAC4kR_a</recordid><startdate>19990727</startdate><enddate>19990727</enddate><creator>O'NEIL; KEITH C</creator><creator>POMERANTZ; GLENN A</creator><creator>CASEY; JON A</creator><creator>PETERSON; BRENDA L</creator><creator>MACKIN; DANIEL S</creator><creator>BALZ; JAMES G</creator><creator>CALLI; CYNTHIA J</creator><creator>LONG; DAVID C</creator><scope>EVB</scope></search><sort><creationdate>19990727</creationdate><title>Process for via fill</title><author>O'NEIL; KEITH C ; POMERANTZ; GLENN A ; CASEY; JON A ; PETERSON; BRENDA L ; MACKIN; DANIEL S ; BALZ; JAMES G ; CALLI; CYNTHIA J ; LONG; DAVID C</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US5927193A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1999</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>COLOUR PRINTING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>LINING MACHINES</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>PRINTING</topic><topic>PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>STAMPS</topic><topic>TRANSPORTING</topic><topic>TYPEWRITERS</topic><toplevel>online_resources</toplevel><creatorcontrib>O'NEIL; KEITH C</creatorcontrib><creatorcontrib>POMERANTZ; GLENN A</creatorcontrib><creatorcontrib>CASEY; JON A</creatorcontrib><creatorcontrib>PETERSON; BRENDA L</creatorcontrib><creatorcontrib>MACKIN; DANIEL S</creatorcontrib><creatorcontrib>BALZ; JAMES G</creatorcontrib><creatorcontrib>CALLI; CYNTHIA J</creatorcontrib><creatorcontrib>LONG; DAVID C</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>O'NEIL; KEITH C</au><au>POMERANTZ; GLENN A</au><au>CASEY; JON A</au><au>PETERSON; BRENDA L</au><au>MACKIN; DANIEL S</au><au>BALZ; JAMES G</au><au>CALLI; CYNTHIA J</au><au>LONG; DAVID C</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Process for via fill</title><date>1999-07-27</date><risdate>1999</risdate><abstract>An apparatus and method is provided for vacuum screen printing a greensheet having vias and both vias and open areas whereby vacuum leakage in the apparatus is minimized and avoids bowing of the screen over the open area of the greensheet. An interposer apparatus is provided comprising at least two layers having vertical through openings in registration with the via openings of the greensheet and screen. The interposer also comprises vertical through openings communicating with the open area of the greensheet and with vent channels of the interposer. A porous membrane is also used either alone or in conjunction with the interposer to provide enhanced screening results.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COLOUR PRINTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINING MACHINES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS PRINTING PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES SEMICONDUCTOR DEVICES STAMPS TRANSPORTING TYPEWRITERS |
title | Process for via fill |
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