Low cost and highly reliable chip-sized package

The invention is directed to a chip-sized package (CSP) and method for making a CSP which is simple to manufacture, less costly and more compact, thus being truly a chip-sized package. The inventive CSP has a chip that has an array of chip ports on an active surface, such as an array of solder or me...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LIM, THIAM BENG
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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