Resin sealing structure for elements

Resin sealing structure for elements

A resin sealing structure according to the invention has convex parts formed in the vicinities of the perimeters of elements on a substrate to prevent thereby the resin, when it is applied for sealing, from invading the wiring parts of the elements. There may be narrow enough gaps between the substr...

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Hauptverfasser: OOTAKE, KENICHI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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KENICHI
description A resin sealing structure according to the invention has convex parts formed in the vicinities of the perimeters of elements on a substrate to prevent thereby the resin, when it is applied for sealing, from invading the wiring parts of the elements. There may be narrow enough gaps between the substrate and the elements not to allow the resin to enter. This structure enables resin sealing to be accomplished at a high yield and dispenses with metallic caps or the like.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Resin sealing structure for elements
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