Geometries and configurations for magnetron sputtering apparatus

A thin film coating system incorporates separate, separately-controlled deposition and reaction zones for depositing materials such as refractory metals and forming oxides and other compounds and alloys of such materials. The associated process involves rotating or translating workpieces past the di...

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Bibliographische Detailangaben

Hauptverfasser:	ALLEN, THOMAS H, DICKEY, ERIC R, SCOBEY, MICHAEL A, SEESER, JAMES W, HICHWA, BRYANT P, LEFEBVRE, PAUL M, VAN HORN, CRAIG C, SOBERANIS, DAVID L, TEMPLE, MICHAEL D, SEDDON, RICHARD I, WENTWORTH, PATRICK R, ILLSLEY, ROLF F, KLINGER, ROBERT F
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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