Energy relieving crack stop
An energy relieving, redundant crack stop and the method of producing the same is disclosed. The redundant pattern allows the crack propagating energy that is not absorbed by the first ring of metallization to be absorbed by a second area of metallization and also provides a greater surface area ove...
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| creator | LEE PEI LEVINE ERNEST N DINKEL BETTINA A |
| description | An energy relieving, redundant crack stop and the method of producing the same is disclosed. The redundant pattern allows the crack propagating energy that is not absorbed by the first ring of metallization to be absorbed by a second area of metallization and also provides a greater surface area over which the crack producing energy may be spread. The redundant crack stop is produced during the metallization process along with the rest of the wiring of the chip surface and, therefore, no additional production steps are necessary to form the structure. |
| format | Patent |
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The redundant pattern allows the crack propagating energy that is not absorbed by the first ring of metallization to be absorbed by a second area of metallization and also provides a greater surface area over which the crack producing energy may be spread. The redundant crack stop is produced during the metallization process along with the rest of the wiring of the chip surface and, therefore, no additional production steps are necessary to form the structure.</description><edition>6</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>1998</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19981110&DB=EPODOC&CC=US&NR=5834829A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19981110&DB=EPODOC&CC=US&NR=5834829A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LEE; PEI</creatorcontrib><creatorcontrib>LEVINE; ERNEST N</creatorcontrib><creatorcontrib>DINKEL; BETTINA A</creatorcontrib><title>Energy relieving crack stop</title><description>An energy relieving, redundant crack stop and the method of producing the same is disclosed. The redundant pattern allows the crack propagating energy that is not absorbed by the first ring of metallization to be absorbed by a second area of metallization and also provides a greater surface area over which the crack producing energy may be spread. The redundant crack stop is produced during the metallization process along with the rest of the wiring of the chip surface and, therefore, no additional production steps are necessary to form the structure.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1998</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJB2zUstSq9UKErNyUwty8xLV0guSkzOViguyS_gYWBNS8wpTuWF0twM8m6uIc4euqkF-fGpxQWJyal5qSXxocGmFsYmFkaWjsaEVQAA898i0w</recordid><startdate>19981110</startdate><enddate>19981110</enddate><creator>LEE; PEI</creator><creator>LEVINE; ERNEST N</creator><creator>DINKEL; BETTINA A</creator><scope>EVB</scope></search><sort><creationdate>19981110</creationdate><title>Energy relieving crack stop</title><author>LEE; PEI ; LEVINE; ERNEST N ; DINKEL; BETTINA A</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US5834829A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1998</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>LEE; PEI</creatorcontrib><creatorcontrib>LEVINE; ERNEST N</creatorcontrib><creatorcontrib>DINKEL; BETTINA A</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LEE; PEI</au><au>LEVINE; ERNEST N</au><au>DINKEL; BETTINA A</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Energy relieving crack stop</title><date>1998-11-10</date><risdate>1998</risdate><abstract>An energy relieving, redundant crack stop and the method of producing the same is disclosed. The redundant pattern allows the crack propagating energy that is not absorbed by the first ring of metallization to be absorbed by a second area of metallization and also provides a greater surface area over which the crack producing energy may be spread. The redundant crack stop is produced during the metallization process along with the rest of the wiring of the chip surface and, therefore, no additional production steps are necessary to form the structure.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Energy relieving crack stop |
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