Apparatus and method for high throughput sputtering

An apparatus in accordance with the present invention provides a single or multi-layer coating to the surface of a plurality of substrates. The apparatus may include a plurality of buffer and sputtering chambers, and an input end and an output end, wherein said substrates are transported through sai...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HOLLARS, DENNIS R, ZUBECK, ROBERT B, PAYNE, GARY L, BONIGUT, JOSEF, WALTRIP, DELBERT F, SMITH, ROBERT M
Format: Patent
Sprache:eng
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