Semiconductor stack structures and fabrication sparing methods utilizing programmable spare circuit

Electronic semiconductor structures, and fabrication and sparing methods, each utilize an electrically programmable spare circuit incorporated with a multichip package. The programmable sparing capability in the multichip package is accomplished either with or without the inclusion of a spare chip(s...

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Bibliographische Detailangaben

Hauptverfasser:	BERTIN, CLAUDE LOUIS, HEDBERG, ERIK LEIGH, HOWELL, WAYNE JOHN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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