Embedded metal planes for thermal management

In order to dissipate heat from an electronic device, there is disclosed a method whereby with the use of metal planes embedded in an insulating substrate, heat generated by the electronic device can be transported and dissipated to a remote, more desirable location.

Bibliographische Detailangaben

Hauptverfasser:	REDDY, PRATHAP AMERWAI, BELKE, JR., ROBERT EDWARD, JAIRAZBHOY, VIVEK AMIR
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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