Semiconductor cap

A method for manufacturing a cap for use in a semiconductor package is disclosed. The semiconductor package includes a semiconductor chip and a substrate. The chip is mounted with the substrate at a chip locus. The method preferably comprises the steps of placing a slug in a die, and exercising the...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	GROSS, LARRY D, CADOVIUS, RICHARD W
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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