Method for forming a monolithic electronic module by stacking planar arrays of integrated circuit chips

A fabrication method for manufacturing a monolithic electronic module comprising a plurality of stacked planar extending arrays of integrated circuit chips. The fabrication method includes dicing a wafer of integrated circuit chips into a plurality of arrays of integrated circuit chips. The arrays o...

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Bibliographische Detailangaben
Hauptverfasser: O'CONNOR, LORETTA JEAN, MALTABES, JOHN GEORGE, COCKERILL, MARTHA ASHLEY CLARK, VOLDMAN, STEVEN HOWARD
Format: Patent
Sprache:eng
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