Digital microelectronic circuit package using buffer dies and programmable device or memory dies
A digital microelectronic replacement package includes at least one buffer die in combination with a programmable device or memory. The buffer die performs the functions of impedance-matching, delay-matching, and voltage-matching, while the programmable device or memory can be used to emulate the lo...
Gespeichert in:
| Hauptverfasser: | , , , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | MICHAEL GERALD T KEYES, JR. KENNETH J DUKES MICHAEL A |
| description | A digital microelectronic replacement package includes at least one buffer die in combination with a programmable device or memory. The buffer die performs the functions of impedance-matching, delay-matching, and voltage-matching, while the programmable device or memory can be used to emulate the logic and/or storage functions of the original digital microelectronic circuit; the package of the invention can be used as a direct replacement for a digital microelectronic circuit without the requirement that the original circuit board be redesigned to accommodate modern voltage, impedance, and delay specifications associated with the programmable device or memory. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US5781791A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US5781791A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US5781791A3</originalsourceid><addsrcrecordid>eNqFzLsKwkAQRuE0FqI-g_MCFkEkWgYv2Kt1nGz-LIN7CbMbwbdXxN7qNB9nWtwPYiWzIy9GIxxM1hjEkBE1o2Qa2DzYgsYkwVI79j2UOkEiDh0NGq2y99w6UIenGFBU8vBRX182LyY9u4TFr7NieTpe9-cVhtggffYIyM3tsqm2ZbUr6_V_8QYI_zz8</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Digital microelectronic circuit package using buffer dies and programmable device or memory dies</title><source>esp@cenet</source><creator>MICHAEL; GERALD T ; KEYES, JR.; KENNETH J ; DUKES; MICHAEL A</creator><creatorcontrib>MICHAEL; GERALD T ; KEYES, JR.; KENNETH J ; DUKES; MICHAEL A</creatorcontrib><description>A digital microelectronic replacement package includes at least one buffer die in combination with a programmable device or memory. The buffer die performs the functions of impedance-matching, delay-matching, and voltage-matching, while the programmable device or memory can be used to emulate the logic and/or storage functions of the original digital microelectronic circuit; the package of the invention can be used as a direct replacement for a digital microelectronic circuit without the requirement that the original circuit board be redesigned to accommodate modern voltage, impedance, and delay specifications associated with the programmable device or memory.</description><edition>6</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>1998</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19980714&DB=EPODOC&CC=US&NR=5781791A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19980714&DB=EPODOC&CC=US&NR=5781791A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MICHAEL; GERALD T</creatorcontrib><creatorcontrib>KEYES, JR.; KENNETH J</creatorcontrib><creatorcontrib>DUKES; MICHAEL A</creatorcontrib><title>Digital microelectronic circuit package using buffer dies and programmable device or memory dies</title><description>A digital microelectronic replacement package includes at least one buffer die in combination with a programmable device or memory. The buffer die performs the functions of impedance-matching, delay-matching, and voltage-matching, while the programmable device or memory can be used to emulate the logic and/or storage functions of the original digital microelectronic circuit; the package of the invention can be used as a direct replacement for a digital microelectronic circuit without the requirement that the original circuit board be redesigned to accommodate modern voltage, impedance, and delay specifications associated with the programmable device or memory.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1998</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqFzLsKwkAQRuE0FqI-g_MCFkEkWgYv2Kt1nGz-LIN7CbMbwbdXxN7qNB9nWtwPYiWzIy9GIxxM1hjEkBE1o2Qa2DzYgsYkwVI79j2UOkEiDh0NGq2y99w6UIenGFBU8vBRX182LyY9u4TFr7NieTpe9-cVhtggffYIyM3tsqm2ZbUr6_V_8QYI_zz8</recordid><startdate>19980714</startdate><enddate>19980714</enddate><creator>MICHAEL; GERALD T</creator><creator>KEYES, JR.; KENNETH J</creator><creator>DUKES; MICHAEL A</creator><scope>EVB</scope></search><sort><creationdate>19980714</creationdate><title>Digital microelectronic circuit package using buffer dies and programmable device or memory dies</title><author>MICHAEL; GERALD T ; KEYES, JR.; KENNETH J ; DUKES; MICHAEL A</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US5781791A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1998</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>MICHAEL; GERALD T</creatorcontrib><creatorcontrib>KEYES, JR.; KENNETH J</creatorcontrib><creatorcontrib>DUKES; MICHAEL A</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MICHAEL; GERALD T</au><au>KEYES, JR.; KENNETH J</au><au>DUKES; MICHAEL A</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Digital microelectronic circuit package using buffer dies and programmable device or memory dies</title><date>1998-07-14</date><risdate>1998</risdate><abstract>A digital microelectronic replacement package includes at least one buffer die in combination with a programmable device or memory. The buffer die performs the functions of impedance-matching, delay-matching, and voltage-matching, while the programmable device or memory can be used to emulate the logic and/or storage functions of the original digital microelectronic circuit; the package of the invention can be used as a direct replacement for a digital microelectronic circuit without the requirement that the original circuit board be redesigned to accommodate modern voltage, impedance, and delay specifications associated with the programmable device or memory.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_US5781791A |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | Digital microelectronic circuit package using buffer dies and programmable device or memory dies |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-13T18%3A10%3A15IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=MICHAEL;%20GERALD%20T&rft.date=1998-07-14&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS5781791A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |