Weatherable outside electronic device enclosure
A network interface device includes a weatherable enclosure having injection molded, die cast, or stamped top and bottom cap portions and a body portion which is extruded. The injection molded portions are fabricated from a polymer, such as polyvinyl chloride, with a higher melt index than the grade...
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creator | HUBBAUER PHILIP SHEVCHUK GEORGE JOHN SHEPHERD LLOYD LAMBERT WILLIAM ROGER DECKER ROBERT LEROY WELD JOHN DAVID |
description | A network interface device includes a weatherable enclosure having injection molded, die cast, or stamped top and bottom cap portions and a body portion which is extruded. The injection molded portions are fabricated from a polymer, such as polyvinyl chloride, with a higher melt index than the grade of polymer used to fabricate the body portion. The body portion has top and bottom openings adapted to receive the top and bottom cap portions. The network interface electrical components are enclosed within the housing. |
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fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US5754643A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US5754643A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US5754643A3</originalsourceid><addsrcrecordid>eNrjZNAPT00syUgtSkzKSVXILy0pzkxJVUjNSU0uKcrPy0xWSEkty0wGiuQl5-QXlxal8jCwpiXmFKfyQmluBnk31xBnD93Ugvz41OKCxOTUvNSS-NBgU3NTEzMTY0djwioAv7UqzQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Weatherable outside electronic device enclosure</title><source>esp@cenet</source><creator>HUBBAUER; PHILIP ; SHEVCHUK; GEORGE JOHN ; SHEPHERD; LLOYD ; LAMBERT; WILLIAM ROGER ; DECKER; ROBERT LEROY ; WELD; JOHN DAVID</creator><creatorcontrib>HUBBAUER; PHILIP ; SHEVCHUK; GEORGE JOHN ; SHEPHERD; LLOYD ; LAMBERT; WILLIAM ROGER ; DECKER; ROBERT LEROY ; WELD; JOHN DAVID</creatorcontrib><description>A network interface device includes a weatherable enclosure having injection molded, die cast, or stamped top and bottom cap portions and a body portion which is extruded. The injection molded portions are fabricated from a polymer, such as polyvinyl chloride, with a higher melt index than the grade of polymer used to fabricate the body portion. The body portion has top and bottom openings adapted to receive the top and bottom cap portions. The network interface electrical components are enclosed within the housing.</description><edition>6</edition><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC COMMUNICATION TECHNIQUE ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SELECTING</subject><creationdate>1998</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19980519&DB=EPODOC&CC=US&NR=5754643A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19980519&DB=EPODOC&CC=US&NR=5754643A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HUBBAUER; PHILIP</creatorcontrib><creatorcontrib>SHEVCHUK; GEORGE JOHN</creatorcontrib><creatorcontrib>SHEPHERD; LLOYD</creatorcontrib><creatorcontrib>LAMBERT; WILLIAM ROGER</creatorcontrib><creatorcontrib>DECKER; ROBERT LEROY</creatorcontrib><creatorcontrib>WELD; JOHN DAVID</creatorcontrib><title>Weatherable outside electronic device enclosure</title><description>A network interface device includes a weatherable enclosure having injection molded, die cast, or stamped top and bottom cap portions and a body portion which is extruded. The injection molded portions are fabricated from a polymer, such as polyvinyl chloride, with a higher melt index than the grade of polymer used to fabricate the body portion. The body portion has top and bottom openings adapted to receive the top and bottom cap portions. The network interface electrical components are enclosed within the housing.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC COMMUNICATION TECHNIQUE</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SELECTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1998</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNAPT00syUgtSkzKSVXILy0pzkxJVUjNSU0uKcrPy0xWSEkty0wGiuQl5-QXlxal8jCwpiXmFKfyQmluBnk31xBnD93Ugvz41OKCxOTUvNSS-NBgU3NTEzMTY0djwioAv7UqzQ</recordid><startdate>19980519</startdate><enddate>19980519</enddate><creator>HUBBAUER; PHILIP</creator><creator>SHEVCHUK; GEORGE JOHN</creator><creator>SHEPHERD; LLOYD</creator><creator>LAMBERT; WILLIAM ROGER</creator><creator>DECKER; ROBERT LEROY</creator><creator>WELD; JOHN DAVID</creator><scope>EVB</scope></search><sort><creationdate>19980519</creationdate><title>Weatherable outside electronic device enclosure</title><author>HUBBAUER; PHILIP ; SHEVCHUK; GEORGE JOHN ; SHEPHERD; LLOYD ; LAMBERT; WILLIAM ROGER ; DECKER; ROBERT LEROY ; WELD; JOHN DAVID</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US5754643A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1998</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC COMMUNICATION TECHNIQUE</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SELECTING</topic><toplevel>online_resources</toplevel><creatorcontrib>HUBBAUER; PHILIP</creatorcontrib><creatorcontrib>SHEVCHUK; GEORGE JOHN</creatorcontrib><creatorcontrib>SHEPHERD; LLOYD</creatorcontrib><creatorcontrib>LAMBERT; WILLIAM ROGER</creatorcontrib><creatorcontrib>DECKER; ROBERT LEROY</creatorcontrib><creatorcontrib>WELD; JOHN DAVID</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HUBBAUER; PHILIP</au><au>SHEVCHUK; GEORGE JOHN</au><au>SHEPHERD; LLOYD</au><au>LAMBERT; WILLIAM ROGER</au><au>DECKER; ROBERT LEROY</au><au>WELD; JOHN DAVID</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Weatherable outside electronic device enclosure</title><date>1998-05-19</date><risdate>1998</risdate><abstract>A network interface device includes a weatherable enclosure having injection molded, die cast, or stamped top and bottom cap portions and a body portion which is extruded. The injection molded portions are fabricated from a polymer, such as polyvinyl chloride, with a higher melt index than the grade of polymer used to fabricate the body portion. The body portion has top and bottom openings adapted to receive the top and bottom cap portions. The network interface electrical components are enclosed within the housing.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record> |
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subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SELECTING |
title | Weatherable outside electronic device enclosure |
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