Apparatus for improving wafer and chuck edge protection

Apparatus for retaining a wafer having improved wafer and chuck edge protection, contains an protection ring that circumscribes a pedestal and is biased to be in constant contact with the backside of the wafer. A biasing element uniformly biases the protection ring into contact with the circumferent...

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Bibliographische Detailangaben
Hauptverfasser: ZUNIGA, LEONEL ARTURO, MAK, ALFRED, PU, BRYAN, SHAN, HONGCHING, SHERSTINSKY, SEMYON, CHEN, LING, KE, KUANG-HAN, ZHANG, SUE, WILSON, SAMUEL C, WELCH, MICHAEL
Format: Patent
Sprache:eng
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