Integrated circuit package

An integrated circuit package comprises a power supply conductor film having a potential and conductor columns insulated from and passed through the power supply conductor film. A power supply conductor column comprises one of the conductor columns connected to a power supply having a potential diff...

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Bibliographische Detailangaben
Hauptverfasser: KANBE, ROKURO, IMAI, RYUJI
Format: Patent
Sprache:eng
Schlagworte:
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