Plasma treatment apparatus and method
A plasma treatment apparatus comprising a chamber earthed, a vacuum pump for exhausting the chamber, a suscepter on which a wafer is mounted, a shower electrode arranged in the chamber, opposing to the suscepter, a unit for supplying plasma generating gas to the wafer on the suscepter through the sh...
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| creator | HIROSE KEIZO SAKAMOTO TAKAO MOMOSE KENJI IMAFUKU KOSUKE TAHARA KAZUHIRO NAITO YUKIO ENDO SHOSUKE NAGASEKI KAZUYA |
| description | A plasma treatment apparatus comprising a chamber earthed, a vacuum pump for exhausting the chamber, a suscepter on which a wafer is mounted, a shower electrode arranged in the chamber, opposing to the suscepter, a unit for supplying plasma generating gas to the wafer on the suscepter through the shower electrode, a first radio frequency power source for adding radio frequency voltage, which has a first frequency f1, to both of the suscepter and the shower electrode, a second radio frequency power source for adding radio frequency voltage, which has a second frequency f2 higher than the first frequency f1, at least to one of the suscepter and the shower electrode, a transformer whose primary side is connected to the first radio frequency power source and whose secondary side to first and second electrodes, and a low pass filter arranged in a circuit on the secondary side of the transformer, and serving to allow radio frequency voltage, which has the first frequency f1, to pass through it but to cut off radio frequency voltage, which has the second frequency f2, while plasma is being generated. |
| format | Patent |
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KEIZO</creatorcontrib><creatorcontrib>SAKAMOTO; TAKAO</creatorcontrib><creatorcontrib>MOMOSE; KENJI</creatorcontrib><creatorcontrib>IMAFUKU; KOSUKE</creatorcontrib><creatorcontrib>TAHARA; KAZUHIRO</creatorcontrib><creatorcontrib>NAITO; YUKIO</creatorcontrib><creatorcontrib>ENDO; SHOSUKE</creatorcontrib><creatorcontrib>NAGASEKI; KAZUYA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HIROSE; KEIZO</au><au>SAKAMOTO; TAKAO</au><au>MOMOSE; KENJI</au><au>IMAFUKU; KOSUKE</au><au>TAHARA; KAZUHIRO</au><au>NAITO; YUKIO</au><au>ENDO; SHOSUKE</au><au>NAGASEKI; KAZUYA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Plasma treatment apparatus and method</title><date>1997-12-16</date><risdate>1997</risdate><abstract>A plasma treatment apparatus comprising a chamber earthed, a vacuum pump for exhausting the chamber, a suscepter on which a wafer is mounted, a shower electrode arranged in the chamber, opposing to the suscepter, a unit for supplying plasma generating gas to the wafer on the suscepter through the shower electrode, a first radio frequency power source for adding radio frequency voltage, which has a first frequency f1, to both of the suscepter and the shower electrode, a second radio frequency power source for adding radio frequency voltage, which has a second frequency f2 higher than the first frequency f1, at least to one of the suscepter and the shower electrode, a transformer whose primary side is connected to the first radio frequency power source and whose secondary side to first and second electrodes, and a low pass filter arranged in a circuit on the secondary side of the transformer, and serving to allow radio frequency voltage, which has the first frequency f1, to pass through it but to cut off radio frequency voltage, which has the second frequency f2, while plasma is being generated.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | Plasma treatment apparatus and method |
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