Polishing aparatus and method
A polishing apparatus for polishing a surface of a workpiece includes a housing unit, a partition wall partitioning an interior of the housing unit into a first chamber and a second chamber, a polishing section disposed in the first chamber and having a turntable with an abrasive cloth mounted on an...
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| creator | HIMUKAI KAZUAKI MISHIMA SHIRO NISHI TOYOMI WATASE MASAKO TOGAWA TETSUJI YAJIMA HIROMI IMOTO YUKIO AOKI RIICHIRO KODAMA SHOICHI SAITO HARUMITSU SHIGETA ATSUSHI KOUNO GISUKE TSUJIMURA MANABU |
| description | A polishing apparatus for polishing a surface of a workpiece includes a housing unit, a partition wall partitioning an interior of the housing unit into a first chamber and a second chamber, a polishing section disposed in the first chamber and having a turntable with an abrasive cloth mounted on an upper surface thereof and a top ring positioned above the turntable for supporting the workpiece to be polished and pressing the workpiece against the abrasive cloth, and a cleaning section disposed in the second chamber and cleaning the workpiece which has been polished. The polishing apparatus further includes a transferring device for transferring the workpiece which has been polished from the polishing section to the cleaning section through an opening and an exhaust system for exhausting ambient air from each of the polishing section and cleaning section separately and independently. |
| format | Patent |
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The polishing apparatus further includes a transferring device for transferring the workpiece which has been polished from the polishing section to the cleaning section through an opening and an exhaust system for exhausting ambient air from each of the polishing section and cleaning section separately and independently.</description><edition>6</edition><language>eng</language><subject>AIR-CONDITIONING, AIR-HUMIDIFICATION, VENTILATION, USE OF AIRCURRENTS FOR SCREENING ; BASIC ELECTRIC ELEMENTS ; BLASTING ; CLEANING ; CLEANING IN GENERAL ; DRESSING OR CONDITIONING OF ABRADING SURFACES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; HEATING ; LIGHTING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; MECHANICAL ENGINEERING ; PERFORMING OPERATIONS ; POLISHING ; PREVENTION OF FOULING IN GENERAL ; RANGES ; SEMICONDUCTOR DEVICES ; TRANSPORTING ; VENTILATING ; WEAPONS</subject><creationdate>1997</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19971021&DB=EPODOC&CC=US&NR=5679059A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19971021&DB=EPODOC&CC=US&NR=5679059A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HIMUKAI; KAZUAKI</creatorcontrib><creatorcontrib>MISHIMA; SHIRO</creatorcontrib><creatorcontrib>NISHI; TOYOMI</creatorcontrib><creatorcontrib>WATASE; MASAKO</creatorcontrib><creatorcontrib>TOGAWA; TETSUJI</creatorcontrib><creatorcontrib>YAJIMA; HIROMI</creatorcontrib><creatorcontrib>IMOTO; YUKIO</creatorcontrib><creatorcontrib>AOKI; RIICHIRO</creatorcontrib><creatorcontrib>KODAMA; SHOICHI</creatorcontrib><creatorcontrib>SAITO; HARUMITSU</creatorcontrib><creatorcontrib>SHIGETA; ATSUSHI</creatorcontrib><creatorcontrib>KOUNO; GISUKE</creatorcontrib><creatorcontrib>TSUJIMURA; MANABU</creatorcontrib><title>Polishing aparatus and method</title><description>A polishing apparatus for polishing a surface of a workpiece includes a housing unit, a partition wall partitioning an interior of the housing unit into a first chamber and a second chamber, a polishing section disposed in the first chamber and having a turntable with an abrasive cloth mounted on an upper surface thereof and a top ring positioned above the turntable for supporting the workpiece to be polished and pressing the workpiece against the abrasive cloth, and a cleaning section disposed in the second chamber and cleaning the workpiece which has been polished. 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KAZUAKI</creatorcontrib><creatorcontrib>MISHIMA; SHIRO</creatorcontrib><creatorcontrib>NISHI; TOYOMI</creatorcontrib><creatorcontrib>WATASE; MASAKO</creatorcontrib><creatorcontrib>TOGAWA; TETSUJI</creatorcontrib><creatorcontrib>YAJIMA; HIROMI</creatorcontrib><creatorcontrib>IMOTO; YUKIO</creatorcontrib><creatorcontrib>AOKI; RIICHIRO</creatorcontrib><creatorcontrib>KODAMA; SHOICHI</creatorcontrib><creatorcontrib>SAITO; HARUMITSU</creatorcontrib><creatorcontrib>SHIGETA; ATSUSHI</creatorcontrib><creatorcontrib>KOUNO; GISUKE</creatorcontrib><creatorcontrib>TSUJIMURA; MANABU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HIMUKAI; KAZUAKI</au><au>MISHIMA; SHIRO</au><au>NISHI; TOYOMI</au><au>WATASE; MASAKO</au><au>TOGAWA; TETSUJI</au><au>YAJIMA; HIROMI</au><au>IMOTO; YUKIO</au><au>AOKI; RIICHIRO</au><au>KODAMA; SHOICHI</au><au>SAITO; HARUMITSU</au><au>SHIGETA; ATSUSHI</au><au>KOUNO; GISUKE</au><au>TSUJIMURA; MANABU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Polishing aparatus and method</title><date>1997-10-21</date><risdate>1997</risdate><abstract>A polishing apparatus for polishing a surface of a workpiece includes a housing unit, a partition wall partitioning an interior of the housing unit into a first chamber and a second chamber, a polishing section disposed in the first chamber and having a turntable with an abrasive cloth mounted on an upper surface thereof and a top ring positioned above the turntable for supporting the workpiece to be polished and pressing the workpiece against the abrasive cloth, and a cleaning section disposed in the second chamber and cleaning the workpiece which has been polished. The polishing apparatus further includes a transferring device for transferring the workpiece which has been polished from the polishing section to the cleaning section through an opening and an exhaust system for exhausting ambient air from each of the polishing section and cleaning section separately and independently.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | AIR-CONDITIONING, AIR-HUMIDIFICATION, VENTILATION, USE OF AIRCURRENTS FOR SCREENING BASIC ELECTRIC ELEMENTS BLASTING CLEANING CLEANING IN GENERAL DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING HEATING LIGHTING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MECHANICAL ENGINEERING PERFORMING OPERATIONS POLISHING PREVENTION OF FOULING IN GENERAL RANGES SEMICONDUCTOR DEVICES TRANSPORTING VENTILATING WEAPONS |
| title | Polishing aparatus and method |
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