Solder ball connections and assembly process
Two substrates are produced each with a planar, mirror-image matrix of metal contacts in a surface wiring layer. The substrates are positioned with the matrices in parallel confrontation which defines pairs of confronting contacts. A metal ball is positioned between each pair of contacts with a resp...
Gespeichert in:
| Hauptverfasser: | , , , , , , , , , , , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | BENENATI JOSEPH ANGELO CAULFIELD THOMAS ACOCELLA JOHN CORBIN, JR. JOHN SAUNDERS WATSON DAVID P HOEBENER KARL GRANT BANKS DONALD RAY |
| description | Two substrates are produced each with a planar, mirror-image matrix of metal contacts in a surface wiring layer. The substrates are positioned with the matrices in parallel confrontation which defines pairs of confronting contacts. A metal ball is positioned between each pair of contacts with a respective volume of joining material between the ball and each of the two respective contacts. The volumes of joining material are simultaneously melted to allow surface tension to align the substrates and to accurately center the balls between each respective pairs of contacts in a plane defines by the matrix of balls. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US5675889A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US5675889A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US5675889A3</originalsourceid><addsrcrecordid>eNrjZNAJzs9JSS1SSErMyVFIzs_LS00uyczPK1ZIzEtRSCwuTs1NyqlUKCjKT04tLuZhYE1LzClO5YXS3Azybq4hzh66qQX58anFBYnJqXmpJfGhwaZm5qYWFpaOxoRVAAAHZyl2</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Solder ball connections and assembly process</title><source>esp@cenet</source><creator>BENENATI; JOSEPH ANGELO ; CAULFIELD; THOMAS ; ACOCELLA; JOHN ; CORBIN, JR.; JOHN SAUNDERS ; WATSON; DAVID P ; HOEBENER; KARL GRANT ; BANKS; DONALD RAY</creator><creatorcontrib>BENENATI; JOSEPH ANGELO ; CAULFIELD; THOMAS ; ACOCELLA; JOHN ; CORBIN, JR.; JOHN SAUNDERS ; WATSON; DAVID P ; HOEBENER; KARL GRANT ; BANKS; DONALD RAY</creatorcontrib><description>Two substrates are produced each with a planar, mirror-image matrix of metal contacts in a surface wiring layer. The substrates are positioned with the matrices in parallel confrontation which defines pairs of confronting contacts. A metal ball is positioned between each pair of contacts with a respective volume of joining material between the ball and each of the two respective contacts. The volumes of joining material are simultaneously melted to allow surface tension to align the substrates and to accurately center the balls between each respective pairs of contacts in a plane defines by the matrix of balls.</description><edition>6</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACHINE TOOLS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>1997</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19971014&DB=EPODOC&CC=US&NR=5675889A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19971014&DB=EPODOC&CC=US&NR=5675889A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>BENENATI; JOSEPH ANGELO</creatorcontrib><creatorcontrib>CAULFIELD; THOMAS</creatorcontrib><creatorcontrib>ACOCELLA; JOHN</creatorcontrib><creatorcontrib>CORBIN, JR.; JOHN SAUNDERS</creatorcontrib><creatorcontrib>WATSON; DAVID P</creatorcontrib><creatorcontrib>HOEBENER; KARL GRANT</creatorcontrib><creatorcontrib>BANKS; DONALD RAY</creatorcontrib><title>Solder ball connections and assembly process</title><description>Two substrates are produced each with a planar, mirror-image matrix of metal contacts in a surface wiring layer. The substrates are positioned with the matrices in parallel confrontation which defines pairs of confronting contacts. A metal ball is positioned between each pair of contacts with a respective volume of joining material between the ball and each of the two respective contacts. The volumes of joining material are simultaneously melted to allow surface tension to align the substrates and to accurately center the balls between each respective pairs of contacts in a plane defines by the matrix of balls.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MACHINE TOOLS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1997</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNAJzs9JSS1SSErMyVFIzs_LS00uyczPK1ZIzEtRSCwuTs1NyqlUKCjKT04tLuZhYE1LzClO5YXS3Azybq4hzh66qQX58anFBYnJqXmpJfGhwaZm5qYWFpaOxoRVAAAHZyl2</recordid><startdate>19971014</startdate><enddate>19971014</enddate><creator>BENENATI; JOSEPH ANGELO</creator><creator>CAULFIELD; THOMAS</creator><creator>ACOCELLA; JOHN</creator><creator>CORBIN, JR.; JOHN SAUNDERS</creator><creator>WATSON; DAVID P</creator><creator>HOEBENER; KARL GRANT</creator><creator>BANKS; DONALD RAY</creator><scope>EVB</scope></search><sort><creationdate>19971014</creationdate><title>Solder ball connections and assembly process</title><author>BENENATI; JOSEPH ANGELO ; CAULFIELD; THOMAS ; ACOCELLA; JOHN ; CORBIN, JR.; JOHN SAUNDERS ; WATSON; DAVID P ; HOEBENER; KARL GRANT ; BANKS; DONALD RAY</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US5675889A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1997</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MACHINE TOOLS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>BENENATI; JOSEPH ANGELO</creatorcontrib><creatorcontrib>CAULFIELD; THOMAS</creatorcontrib><creatorcontrib>ACOCELLA; JOHN</creatorcontrib><creatorcontrib>CORBIN, JR.; JOHN SAUNDERS</creatorcontrib><creatorcontrib>WATSON; DAVID P</creatorcontrib><creatorcontrib>HOEBENER; KARL GRANT</creatorcontrib><creatorcontrib>BANKS; DONALD RAY</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>BENENATI; JOSEPH ANGELO</au><au>CAULFIELD; THOMAS</au><au>ACOCELLA; JOHN</au><au>CORBIN, JR.; JOHN SAUNDERS</au><au>WATSON; DAVID P</au><au>HOEBENER; KARL GRANT</au><au>BANKS; DONALD RAY</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Solder ball connections and assembly process</title><date>1997-10-14</date><risdate>1997</risdate><abstract>Two substrates are produced each with a planar, mirror-image matrix of metal contacts in a surface wiring layer. The substrates are positioned with the matrices in parallel confrontation which defines pairs of confronting contacts. A metal ball is positioned between each pair of contacts with a respective volume of joining material between the ball and each of the two respective contacts. The volumes of joining material are simultaneously melted to allow surface tension to align the substrates and to accurately center the balls between each respective pairs of contacts in a plane defines by the matrix of balls.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_US5675889A |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | Solder ball connections and assembly process |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-10T08%3A18%3A27IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=BENENATI;%20JOSEPH%20ANGELO&rft.date=1997-10-14&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS5675889A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |