Method for solder-bonding contact pad arrays

Solder bonding of first and second contact pad arrays is accomplished by forming contact structures, such as posts with vertical or tapered sides, on the contact pads of the first array and solder bumps on the second array. The respective contact structures should have an average cross-sectional are...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	D'ASARO, LUCIAN ARTHUR, DAHRINGER, DONALD WILLIAM, TSENG, BETTY JYUE, HUI, SANGHEE PARK, CHIROVSKY, LEO MARIA FREISHYN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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