Method for solder-bonding contact pad arrays
Solder bonding of first and second contact pad arrays is accomplished by forming contact structures, such as posts with vertical or tapered sides, on the contact pads of the first array and solder bumps on the second array. The respective contact structures should have an average cross-sectional are...
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| creator | D'ASARO LUCIAN ARTHUR DAHRINGER DONALD WILLIAM TSENG BETTY JYUE HUI SANGHEE PARK CHIROVSKY LEO MARIA FREISHYN |
| description | Solder bonding of first and second contact pad arrays is accomplished by forming contact structures, such as posts with vertical or tapered sides, on the contact pads of the first array and solder bumps on the second array. The respective contact structures should have an average cross-sectional area that is less than the average cross-sectional area of the corresponding solder bumps. The contact structures and solder bumps are then bonded by a bonding process at a temperature and pressure where the solder bumps deform and envelop at least a portion of the respective contact structures. It is possible to employ the contact structures as a compression stop during the bonding process. The temperature should be below the melting points of the contact structures. In this manner, solder bump spreading can be reduced during bonding which correspondingly reduces electrical shorting of adjacent formed interconnect bonds. |
| format | Patent |
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The respective contact structures should have an average cross-sectional area that is less than the average cross-sectional area of the corresponding solder bumps. The contact structures and solder bumps are then bonded by a bonding process at a temperature and pressure where the solder bumps deform and envelop at least a portion of the respective contact structures. It is possible to employ the contact structures as a compression stop during the bonding process. The temperature should be below the melting points of the contact structures. 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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | Method for solder-bonding contact pad arrays |
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