Method of fabricating a flex laminate package

Disclosed is a parallel processor packaging structure and a method for manufacturing the structure. The individual logic and memory elements are on printed circuit cards. These printed circuit boards and cards are, in turn, mounted on or connected to circuitized flexible substrates extending outward...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KRESGE, JOHN S, HECK, HOWARD L, DAVIS, CHARLES R, LIGHT, DAVID N, TRIVEDI, AJIT K, KOLIAS, JOHN T, DUFFY, THOMAS P, HANAKOVIC, STEVEN L
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CURRENT COLLECTORS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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