Electromechanical module with post-solder attachable/removable heat sink frame and low profile
An electromechanical module comprises an IC package having a top surface which dissipates heat and a heat sink which is held by a frame in direct thermal contact with the top surface. This frame includes a pair of spaced-apart elongated beams and a pair of end members which connect to opposite ends...
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| creator | SMILEY STEPHEN A TUSTANIWSKYJ JERRY I |
| description | An electromechanical module comprises an IC package having a top surface which dissipates heat and a heat sink which is held by a frame in direct thermal contact with the top surface. This frame includes a pair of spaced-apart elongated beams and a pair of end members which connect to opposite ends of the beams; and the beams together with the end members surround the IC package and expose all of the top surface. Thus, the heat sink can be in direct thermal contact with all of the top surface and can extend past it without having to step up to get over the frame. To attach/remove the frame from the IC package, each end member has at least one leg with a lip that catches on the bottom surface of the IC package; and, when the beams are manually bowed, the lips on the legs move further apart and past the bottom surface. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US5579205A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US5579205A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US5579205A3</originalsourceid><addsrcrecordid>eNqFyrEKwjAURuEuDqI-g_cFiqIU6ShScVdXyzX9S4M3uSGJ9vVVcHc6Z_imxa0RmBzVwQzsrWEhp91TQKPNAwVNuUwqHSJxzvxBd8EqwunrezSAMyXrH9RHdiD2HYmOFKL2VjAvJj1LwuLXWbE8NpfDqUTQFimwgUdur-eq2tWbdbXf_hdvlQs8Tw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Electromechanical module with post-solder attachable/removable heat sink frame and low profile</title><source>esp@cenet</source><creator>SMILEY; STEPHEN A ; TUSTANIWSKYJ; JERRY I</creator><creatorcontrib>SMILEY; STEPHEN A ; TUSTANIWSKYJ; JERRY I</creatorcontrib><description>An electromechanical module comprises an IC package having a top surface which dissipates heat and a heat sink which is held by a frame in direct thermal contact with the top surface. This frame includes a pair of spaced-apart elongated beams and a pair of end members which connect to opposite ends of the beams; and the beams together with the end members surround the IC package and expose all of the top surface. Thus, the heat sink can be in direct thermal contact with all of the top surface and can extend past it without having to step up to get over the frame. To attach/remove the frame from the IC package, each end member has at least one leg with a lip that catches on the bottom surface of the IC package; and, when the beams are manually bowed, the lips on the legs move further apart and past the bottom surface.</description><edition>6</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC ; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS ; SEMICONDUCTOR DEVICES ; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ; TECHNICAL SUBJECTS COVERED BY FORMER USPC ; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</subject><creationdate>1996</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19961126&DB=EPODOC&CC=US&NR=5579205A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19961126&DB=EPODOC&CC=US&NR=5579205A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SMILEY; STEPHEN A</creatorcontrib><creatorcontrib>TUSTANIWSKYJ; JERRY I</creatorcontrib><title>Electromechanical module with post-solder attachable/removable heat sink frame and low profile</title><description>An electromechanical module comprises an IC package having a top surface which dissipates heat and a heat sink which is held by a frame in direct thermal contact with the top surface. This frame includes a pair of spaced-apart elongated beams and a pair of end members which connect to opposite ends of the beams; and the beams together with the end members surround the IC package and expose all of the top surface. Thus, the heat sink can be in direct thermal contact with all of the top surface and can extend past it without having to step up to get over the frame. To attach/remove the frame from the IC package, each end member has at least one leg with a lip that catches on the bottom surface of the IC package; and, when the beams are manually bowed, the lips on the legs move further apart and past the bottom surface.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC</subject><subject>GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER USPC</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1996</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqFyrEKwjAURuEuDqI-g_cFiqIU6ShScVdXyzX9S4M3uSGJ9vVVcHc6Z_imxa0RmBzVwQzsrWEhp91TQKPNAwVNuUwqHSJxzvxBd8EqwunrezSAMyXrH9RHdiD2HYmOFKL2VjAvJj1LwuLXWbE8NpfDqUTQFimwgUdur-eq2tWbdbXf_hdvlQs8Tw</recordid><startdate>19961126</startdate><enddate>19961126</enddate><creator>SMILEY; STEPHEN A</creator><creator>TUSTANIWSKYJ; JERRY I</creator><scope>EVB</scope></search><sort><creationdate>19961126</creationdate><title>Electromechanical module with post-solder attachable/removable heat sink frame and low profile</title><author>SMILEY; STEPHEN A ; TUSTANIWSKYJ; JERRY I</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US5579205A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1996</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC</topic><topic>GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER USPC</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</topic><toplevel>online_resources</toplevel><creatorcontrib>SMILEY; STEPHEN A</creatorcontrib><creatorcontrib>TUSTANIWSKYJ; JERRY I</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SMILEY; STEPHEN A</au><au>TUSTANIWSKYJ; JERRY I</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Electromechanical module with post-solder attachable/removable heat sink frame and low profile</title><date>1996-11-26</date><risdate>1996</risdate><abstract>An electromechanical module comprises an IC package having a top surface which dissipates heat and a heat sink which is held by a frame in direct thermal contact with the top surface. This frame includes a pair of spaced-apart elongated beams and a pair of end members which connect to opposite ends of the beams; and the beams together with the end members surround the IC package and expose all of the top surface. Thus, the heat sink can be in direct thermal contact with all of the top surface and can extend past it without having to step up to get over the frame. To attach/remove the frame from the IC package, each end member has at least one leg with a lip that catches on the bottom surface of the IC package; and, when the beams are manually bowed, the lips on the legs move further apart and past the bottom surface.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS |
| title | Electromechanical module with post-solder attachable/removable heat sink frame and low profile |
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