Orbital motion chemical-mechanical polishing apparatus and method of fabrication

A method and apparatus for polishing a thin film formed on a semiconductor substrate. A table covered with a polishing pad is orbited about an axis. Slurry is fed through a plurality of spaced-apart holes formed through the polishing pad to uniformly distribute slurry across the pad surface during p...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LOUKE, SAMUEL F, OLIVER, MICHAEL R, BARNS, CHRISTOPHER E, BREIVOGEL, JOSEPH R, YAU, LEOPOLDO D
Format:	Patent
Sprache:	eng
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING
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