Single layer leadframe design with groundplane capability

An electronic package including a leadframe that includes a single layer of an electrically conducting material, a semiconductor chip support, a common ground portion surrounding the semiconductor chip support and electrically connected thereto, a plurality of signal leads electrically isolated from...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	DIFFENDERFER, STEVEN J, SHAUKATULLAH, HUSSAIN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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