Electron beam inspection system and method
There is disclosed numerous embodiments of a method and apparatus for a particle scanning system and an automatic inspection system. In each of these a particle beam is directed at the surface of a substrate for scanning that substrate. Also included are a selection of detectors to detect at least o...
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| creator | DESAI ANIL LING MING-YIE PAUL RAY BHASKAR CHETANA MEISBURGER DAN SMITH DAVID E. A DOHSE HANS WONG SAM HUTCHESON TIMOTHY L GREENE JOHN CLARK DAVID J LELE SURENDRA MUNRO ERIC ROUGH KIRKWOOD BECKER BARRY VENEKLASEN LEE KIRK CHRIS PEARCE-PERCY HENRY EMGE DENNIS SIMMONS RICHARD OYANG YEN-JEN WIECZOREK PAUL WALTERS DEAN NGUYEN HOI T TAYLOR JOHN CHADWICK CURT JOHNSON RALPH ROBINSON MIKE DUTTA APRIL JAU JACK Y BRODIE ALAN D PAN CHUNG-SHIH LIN CHUN C MCMURTRY JOHN |
| description | There is disclosed numerous embodiments of a method and apparatus for a particle scanning system and an automatic inspection system. In each of these a particle beam is directed at the surface of a substrate for scanning that substrate. Also included are a selection of detectors to detect at least one of the secondary particles, back-scattered particles and transmitted particles from the substrate. The substrate is mounted on an x-y stage to provide it with at least one degree of freedom while the substrate is being scanned by the/particle beam. The substrate is also subjected to an electric field on it's surface to accelerate the secondary particles. The system also has the capability to accurately measure the position of the substrate with respect to the charged particle beam. Additionally, there is an optical alignment means for initially aligning the substrate beneath the,particle beam means. To function most efficiently there is also a vacuum means for evacuating and repressurizing a chamber containing the substrate. The vacuum means can be used to hold one substrate at vacuum while a second one is being loaded/unloaded, evacuated or repressurized. Alternately, the vacuum means can simultaneously evacuate a plurality of substrates prior to inspection and repressurize of the same plurality of substrates following inspection. In the inspection configuration, there is also a comparison means for comparing the pattern on the substrate with a second pattern. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US5502306A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US5502306A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US5502306A3</originalsourceid><addsrcrecordid>eNrjZNByzUlNLinKz1NISk3MVcjMKy4A8jOB_OLK4pLUXIXEvBSF3NSSjPwUHgbWtMSc4lReKM3NIO_mGuLsoZtakB-fWlyQmJyal1oSHxpsampgZGxg5mhMWAUAnqAoaw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Electron beam inspection system and method</title><source>esp@cenet</source><creator>DESAI; ANIL ; LING; MING-YIE ; PAUL; RAY ; BHASKAR; CHETANA ; MEISBURGER; DAN ; SMITH; DAVID E. A ; DOHSE; HANS ; WONG; SAM ; HUTCHESON; TIMOTHY L ; GREENE; JOHN ; CLARK; DAVID J ; LELE; SURENDRA ; MUNRO; ERIC ; ROUGH; KIRKWOOD ; BECKER; BARRY ; VENEKLASEN; LEE ; KIRK; CHRIS ; PEARCE-PERCY; HENRY ; EMGE; DENNIS ; SIMMONS; RICHARD ; OYANG; YEN-JEN ; WIECZOREK; PAUL ; WALTERS; DEAN ; NGUYEN; HOI T ; TAYLOR; JOHN ; CHADWICK; CURT ; JOHNSON; RALPH ; ROBINSON; MIKE ; DUTTA; APRIL ; JAU; JACK Y ; BRODIE; ALAN D ; PAN; CHUNG-SHIH ; LIN; CHUN C ; MCMURTRY; JOHN</creator><creatorcontrib>DESAI; ANIL ; LING; MING-YIE ; PAUL; RAY ; BHASKAR; CHETANA ; MEISBURGER; DAN ; SMITH; DAVID E. A ; DOHSE; HANS ; WONG; SAM ; HUTCHESON; TIMOTHY L ; GREENE; JOHN ; CLARK; DAVID J ; LELE; SURENDRA ; MUNRO; ERIC ; ROUGH; KIRKWOOD ; BECKER; BARRY ; VENEKLASEN; LEE ; KIRK; CHRIS ; PEARCE-PERCY; HENRY ; EMGE; DENNIS ; SIMMONS; RICHARD ; OYANG; YEN-JEN ; WIECZOREK; PAUL ; WALTERS; DEAN ; NGUYEN; HOI T ; TAYLOR; JOHN ; CHADWICK; CURT ; JOHNSON; RALPH ; ROBINSON; MIKE ; DUTTA; APRIL ; JAU; JACK Y ; BRODIE; ALAN D ; PAN; CHUNG-SHIH ; LIN; CHUN C ; MCMURTRY; JOHN</creatorcontrib><description>There is disclosed numerous embodiments of a method and apparatus for a particle scanning system and an automatic inspection system. In each of these a particle beam is directed at the surface of a substrate for scanning that substrate. Also included are a selection of detectors to detect at least one of the secondary particles, back-scattered particles and transmitted particles from the substrate. The substrate is mounted on an x-y stage to provide it with at least one degree of freedom while the substrate is being scanned by the/particle beam. The substrate is also subjected to an electric field on it's surface to accelerate the secondary particles. The system also has the capability to accurately measure the position of the substrate with respect to the charged particle beam. Additionally, there is an optical alignment means for initially aligning the substrate beneath the,particle beam means. To function most efficiently there is also a vacuum means for evacuating and repressurizing a chamber containing the substrate. The vacuum means can be used to hold one substrate at vacuum while a second one is being loaded/unloaded, evacuated or repressurized. Alternately, the vacuum means can simultaneously evacuate a plurality of substrates prior to inspection and repressurize of the same plurality of substrates following inspection. In the inspection configuration, there is also a comparison means for comparing the pattern on the substrate with a second pattern.</description><edition>6</edition><language>eng</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; BASIC ELECTRIC ELEMENTS ; CINEMATOGRAPHY ; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROGRAPHY ; HOLOGRAPHY ; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES ; MATERIALS THEREFOR ; MEASURING ; MEASURING ANGLES ; MEASURING AREAS ; MEASURING ELECTRIC VARIABLES ; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS ; MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS ; MEASURING MAGNETIC VARIABLES ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; SEMICONDUCTOR DEVICES ; TESTING</subject><creationdate>1996</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19960326&DB=EPODOC&CC=US&NR=5502306A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25555,76308</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19960326&DB=EPODOC&CC=US&NR=5502306A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>DESAI; ANIL</creatorcontrib><creatorcontrib>LING; MING-YIE</creatorcontrib><creatorcontrib>PAUL; RAY</creatorcontrib><creatorcontrib>BHASKAR; CHETANA</creatorcontrib><creatorcontrib>MEISBURGER; DAN</creatorcontrib><creatorcontrib>SMITH; DAVID E. A</creatorcontrib><creatorcontrib>DOHSE; HANS</creatorcontrib><creatorcontrib>WONG; SAM</creatorcontrib><creatorcontrib>HUTCHESON; TIMOTHY L</creatorcontrib><creatorcontrib>GREENE; JOHN</creatorcontrib><creatorcontrib>CLARK; DAVID J</creatorcontrib><creatorcontrib>LELE; SURENDRA</creatorcontrib><creatorcontrib>MUNRO; ERIC</creatorcontrib><creatorcontrib>ROUGH; KIRKWOOD</creatorcontrib><creatorcontrib>BECKER; BARRY</creatorcontrib><creatorcontrib>VENEKLASEN; LEE</creatorcontrib><creatorcontrib>KIRK; CHRIS</creatorcontrib><creatorcontrib>PEARCE-PERCY; HENRY</creatorcontrib><creatorcontrib>EMGE; DENNIS</creatorcontrib><creatorcontrib>SIMMONS; RICHARD</creatorcontrib><creatorcontrib>OYANG; YEN-JEN</creatorcontrib><creatorcontrib>WIECZOREK; PAUL</creatorcontrib><creatorcontrib>WALTERS; DEAN</creatorcontrib><creatorcontrib>NGUYEN; HOI T</creatorcontrib><creatorcontrib>TAYLOR; JOHN</creatorcontrib><creatorcontrib>CHADWICK; CURT</creatorcontrib><creatorcontrib>JOHNSON; RALPH</creatorcontrib><creatorcontrib>ROBINSON; MIKE</creatorcontrib><creatorcontrib>DUTTA; APRIL</creatorcontrib><creatorcontrib>JAU; JACK Y</creatorcontrib><creatorcontrib>BRODIE; ALAN D</creatorcontrib><creatorcontrib>PAN; CHUNG-SHIH</creatorcontrib><creatorcontrib>LIN; CHUN C</creatorcontrib><creatorcontrib>MCMURTRY; JOHN</creatorcontrib><title>Electron beam inspection system and method</title><description>There is disclosed numerous embodiments of a method and apparatus for a particle scanning system and an automatic inspection system. In each of these a particle beam is directed at the surface of a substrate for scanning that substrate. Also included are a selection of detectors to detect at least one of the secondary particles, back-scattered particles and transmitted particles from the substrate. The substrate is mounted on an x-y stage to provide it with at least one degree of freedom while the substrate is being scanned by the/particle beam. The substrate is also subjected to an electric field on it's surface to accelerate the secondary particles. The system also has the capability to accurately measure the position of the substrate with respect to the charged particle beam. Additionally, there is an optical alignment means for initially aligning the substrate beneath the,particle beam means. To function most efficiently there is also a vacuum means for evacuating and repressurizing a chamber containing the substrate. The vacuum means can be used to hold one substrate at vacuum while a second one is being loaded/unloaded, evacuated or repressurized. Alternately, the vacuum means can simultaneously evacuate a plurality of substrates prior to inspection and repressurize of the same plurality of substrates following inspection. In the inspection configuration, there is also a comparison means for comparing the pattern on the substrate with a second pattern.</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CINEMATOGRAPHY</subject><subject>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</subject><subject>MATERIALS THEREFOR</subject><subject>MEASURING</subject><subject>MEASURING ANGLES</subject><subject>MEASURING AREAS</subject><subject>MEASURING ELECTRIC VARIABLES</subject><subject>MEASURING IRREGULARITIES OF SURFACES OR CONTOURS</subject><subject>MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS</subject><subject>MEASURING MAGNETIC VARIABLES</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1996</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNByzUlNLinKz1NISk3MVcjMKy4A8jOB_OLK4pLUXIXEvBSF3NSSjPwUHgbWtMSc4lReKM3NIO_mGuLsoZtakB-fWlyQmJyal1oSHxpsampgZGxg5mhMWAUAnqAoaw</recordid><startdate>19960326</startdate><enddate>19960326</enddate><creator>DESAI; ANIL</creator><creator>LING; MING-YIE</creator><creator>PAUL; RAY</creator><creator>BHASKAR; CHETANA</creator><creator>MEISBURGER; DAN</creator><creator>SMITH; DAVID E. 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A ; DOHSE; HANS ; WONG; SAM ; HUTCHESON; TIMOTHY L ; GREENE; JOHN ; CLARK; DAVID J ; LELE; SURENDRA ; MUNRO; ERIC ; ROUGH; KIRKWOOD ; BECKER; BARRY ; VENEKLASEN; LEE ; KIRK; CHRIS ; PEARCE-PERCY; HENRY ; EMGE; DENNIS ; SIMMONS; RICHARD ; OYANG; YEN-JEN ; WIECZOREK; PAUL ; WALTERS; DEAN ; NGUYEN; HOI T ; TAYLOR; JOHN ; CHADWICK; CURT ; JOHNSON; RALPH ; ROBINSON; MIKE ; DUTTA; APRIL ; JAU; JACK Y ; BRODIE; ALAN D ; PAN; CHUNG-SHIH ; LIN; CHUN C ; MCMURTRY; JOHN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US5502306A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1996</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CINEMATOGRAPHY</topic><topic>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</topic><topic>MATERIALS THEREFOR</topic><topic>MEASURING</topic><topic>MEASURING ANGLES</topic><topic>MEASURING AREAS</topic><topic>MEASURING ELECTRIC VARIABLES</topic><topic>MEASURING IRREGULARITIES OF SURFACES OR CONTOURS</topic><topic>MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS</topic><topic>MEASURING MAGNETIC VARIABLES</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>DESAI; ANIL</creatorcontrib><creatorcontrib>LING; MING-YIE</creatorcontrib><creatorcontrib>PAUL; RAY</creatorcontrib><creatorcontrib>BHASKAR; CHETANA</creatorcontrib><creatorcontrib>MEISBURGER; DAN</creatorcontrib><creatorcontrib>SMITH; DAVID E. 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A</au><au>DOHSE; HANS</au><au>WONG; SAM</au><au>HUTCHESON; TIMOTHY L</au><au>GREENE; JOHN</au><au>CLARK; DAVID J</au><au>LELE; SURENDRA</au><au>MUNRO; ERIC</au><au>ROUGH; KIRKWOOD</au><au>BECKER; BARRY</au><au>VENEKLASEN; LEE</au><au>KIRK; CHRIS</au><au>PEARCE-PERCY; HENRY</au><au>EMGE; DENNIS</au><au>SIMMONS; RICHARD</au><au>OYANG; YEN-JEN</au><au>WIECZOREK; PAUL</au><au>WALTERS; DEAN</au><au>NGUYEN; HOI T</au><au>TAYLOR; JOHN</au><au>CHADWICK; CURT</au><au>JOHNSON; RALPH</au><au>ROBINSON; MIKE</au><au>DUTTA; APRIL</au><au>JAU; JACK Y</au><au>BRODIE; ALAN D</au><au>PAN; CHUNG-SHIH</au><au>LIN; CHUN C</au><au>MCMURTRY; JOHN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Electron beam inspection system and method</title><date>1996-03-26</date><risdate>1996</risdate><abstract>There is disclosed numerous embodiments of a method and apparatus for a particle scanning system and an automatic inspection system. In each of these a particle beam is directed at the surface of a substrate for scanning that substrate. Also included are a selection of detectors to detect at least one of the secondary particles, back-scattered particles and transmitted particles from the substrate. The substrate is mounted on an x-y stage to provide it with at least one degree of freedom while the substrate is being scanned by the/particle beam. The substrate is also subjected to an electric field on it's surface to accelerate the secondary particles. The system also has the capability to accurately measure the position of the substrate with respect to the charged particle beam. Additionally, there is an optical alignment means for initially aligning the substrate beneath the,particle beam means. To function most efficiently there is also a vacuum means for evacuating and repressurizing a chamber containing the substrate. The vacuum means can be used to hold one substrate at vacuum while a second one is being loaded/unloaded, evacuated or repressurized. Alternately, the vacuum means can simultaneously evacuate a plurality of substrates prior to inspection and repressurize of the same plurality of substrates following inspection. In the inspection configuration, there is also a comparison means for comparing the pattern on the substrate with a second pattern.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MATERIALS THEREFOR MEASURING MEASURING ANGLES MEASURING AREAS MEASURING ELECTRIC VARIABLES MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS MEASURING MAGNETIC VARIABLES ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES TESTING |
| title | Electron beam inspection system and method |
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