Method of shaping inter-substrate plug and receptacles interconnects

A method electrically and mechanically interconnects two surfaces of high density first and second semiconductor devices. The first semiconductor device (10) is formed with plug members (22) connected to nodes (18) of its circuit elements (14) and protruding from the first semiconductor device. The...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HUGHES, HENRY G, GURTLER, RICHARD W
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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