Method and apparatus for detecting defective semiconductor wafers during fabrication thereof
An apparatus and method for detecting burnt resist or mask on the surface of a semiconductor integrated circuit wafer during fabrication thereof. A light source and light sensor are utilized to identify the flat matte surface finish of burnt resist or mask and shut down the fabrication process befor...
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creator | HAMILTON JEFFREY L |
description | An apparatus and method for detecting burnt resist or mask on the surface of a semiconductor integrated circuit wafer during fabrication thereof. A light source and light sensor are utilized to identify the flat matte surface finish of burnt resist or mask and shut down the fabrication process before a large number of semiconductor wafers are ruined. The burnt resist or mask is detected by the lack of reflected light from the surface of the wafer compared with the light reflected from the surface of a known good resist coated wafer. |
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A light source and light sensor are utilized to identify the flat matte surface finish of burnt resist or mask and shut down the fabrication process before a large number of semiconductor wafers are ruined. 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A light source and light sensor are utilized to identify the flat matte surface finish of burnt resist or mask and shut down the fabrication process before a large number of semiconductor wafers are ruined. The burnt resist or mask is detected by the lack of reflected light from the surface of the wafer compared with the light reflected from the surface of a known good resist coated wafer.</description><subject>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</subject><subject>MEASURING</subject><subject>PHYSICS</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1995</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqFyrEKAjEQhOFrLER9BvMCNpqzF1FsrNROONZk9i6gSUg2-vrmwN5imL_4ps39DBmCVeTrYqREUrLikJSFwIjzfS0e6w2V8XImeFuMVPEhRsrKljQqpkdyhsQFr2RAQuB5M2F6Zix-P2uWx8N1f1ohhg45koGHdLdLq7Veb9vd5r_4AiLfO_o</recordid><startdate>19950822</startdate><enddate>19950822</enddate><creator>HAMILTON; JEFFREY L</creator><scope>EVB</scope></search><sort><creationdate>19950822</creationdate><title>Method and apparatus for detecting defective semiconductor wafers during fabrication thereof</title><author>HAMILTON; JEFFREY L</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US5444265A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1995</creationdate><topic>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</topic><topic>MEASURING</topic><topic>PHYSICS</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>HAMILTON; JEFFREY L</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HAMILTON; JEFFREY L</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method and apparatus for detecting defective semiconductor wafers during fabrication thereof</title><date>1995-08-22</date><risdate>1995</risdate><abstract>An apparatus and method for detecting burnt resist or mask on the surface of a semiconductor integrated circuit wafer during fabrication thereof. A light source and light sensor are utilized to identify the flat matte surface finish of burnt resist or mask and shut down the fabrication process before a large number of semiconductor wafers are ruined. The burnt resist or mask is detected by the lack of reflected light from the surface of the wafer compared with the light reflected from the surface of a known good resist coated wafer.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record> |
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subjects | INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING PHYSICS TESTING |
title | Method and apparatus for detecting defective semiconductor wafers during fabrication thereof |
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