Printed wiring boards having low signal-to-ground ratios
Printed wiring boards having low signal-to-ground ratios. Printed wiring boards described herein comprise a first and second sides, and a plurality of signal plated-through-holes extending from the first side to the second side of the printed wiring board. There is also provided a plurality of groun...
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| creator | MROCZKOWSKI ROBERT S ROTHENBERGER RICHARD E |
| description | Printed wiring boards having low signal-to-ground ratios. Printed wiring boards described herein comprise a first and second sides, and a plurality of signal plated-through-holes extending from the first side to the second side of the printed wiring board. There is also provided a plurality of ground plated-through-holes extending from the first side to the second side of the printed wiring board, and a ground plane plated on a first side and in electrical communication with selected ones of the plurality of ground plated-through-holes and defining a signal-to-ground ratio for the printed wiring boards. Printed wiring boards described herein with plating patterns in accordance with the invention are versatile and ensure high electrical integrity by modifying the signal-to-ground ratio of the printed wiring boards and enabling higher density of contact pads. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US5417578A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US5417578A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US5417578A3</originalsourceid><addsrcrecordid>eNrjZLAIKMrMK0lNUSjPBDLSFZLyE4tSihUyEstAvJz8coXizPS8xBzdknzd9KL80rwUhaLEksz8Yh4G1rTEnOJUXijNzSDv5hri7KGbWpAfn1pckJicmpdaEh8abGpiaG5qbuFoTFgFAGumLd8</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Printed wiring boards having low signal-to-ground ratios</title><source>esp@cenet</source><creator>MROCZKOWSKI; ROBERT S ; ROTHENBERGER; RICHARD E</creator><creatorcontrib>MROCZKOWSKI; ROBERT S ; ROTHENBERGER; RICHARD E</creatorcontrib><description>Printed wiring boards having low signal-to-ground ratios. Printed wiring boards described herein comprise a first and second sides, and a plurality of signal plated-through-holes extending from the first side to the second side of the printed wiring board. There is also provided a plurality of ground plated-through-holes extending from the first side to the second side of the printed wiring board, and a ground plane plated on a first side and in electrical communication with selected ones of the plurality of ground plated-through-holes and defining a signal-to-ground ratio for the printed wiring boards. Printed wiring boards described herein with plating patterns in accordance with the invention are versatile and ensure high electrical integrity by modifying the signal-to-ground ratio of the printed wiring boards and enabling higher density of contact pads.</description><edition>6</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CURRENT COLLECTORS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; LINE CONNECTORS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>1995</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19950523&DB=EPODOC&CC=US&NR=5417578A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19950523&DB=EPODOC&CC=US&NR=5417578A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MROCZKOWSKI; ROBERT S</creatorcontrib><creatorcontrib>ROTHENBERGER; RICHARD E</creatorcontrib><title>Printed wiring boards having low signal-to-ground ratios</title><description>Printed wiring boards having low signal-to-ground ratios. Printed wiring boards described herein comprise a first and second sides, and a plurality of signal plated-through-holes extending from the first side to the second side of the printed wiring board. There is also provided a plurality of ground plated-through-holes extending from the first side to the second side of the printed wiring board, and a ground plane plated on a first side and in electrical communication with selected ones of the plurality of ground plated-through-holes and defining a signal-to-ground ratio for the printed wiring boards. Printed wiring boards described herein with plating patterns in accordance with the invention are versatile and ensure high electrical integrity by modifying the signal-to-ground ratio of the printed wiring boards and enabling higher density of contact pads.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CURRENT COLLECTORS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>LINE CONNECTORS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1995</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLAIKMrMK0lNUSjPBDLSFZLyE4tSihUyEstAvJz8coXizPS8xBzdknzd9KL80rwUhaLEksz8Yh4G1rTEnOJUXijNzSDv5hri7KGbWpAfn1pckJicmpdaEh8abGpiaG5qbuFoTFgFAGumLd8</recordid><startdate>19950523</startdate><enddate>19950523</enddate><creator>MROCZKOWSKI; ROBERT S</creator><creator>ROTHENBERGER; RICHARD E</creator><scope>EVB</scope></search><sort><creationdate>19950523</creationdate><title>Printed wiring boards having low signal-to-ground ratios</title><author>MROCZKOWSKI; ROBERT S ; ROTHENBERGER; RICHARD E</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US5417578A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1995</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CURRENT COLLECTORS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>LINE CONNECTORS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>MROCZKOWSKI; ROBERT S</creatorcontrib><creatorcontrib>ROTHENBERGER; RICHARD E</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MROCZKOWSKI; ROBERT S</au><au>ROTHENBERGER; RICHARD E</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Printed wiring boards having low signal-to-ground ratios</title><date>1995-05-23</date><risdate>1995</risdate><abstract>Printed wiring boards having low signal-to-ground ratios. Printed wiring boards described herein comprise a first and second sides, and a plurality of signal plated-through-holes extending from the first side to the second side of the printed wiring board. There is also provided a plurality of ground plated-through-holes extending from the first side to the second side of the printed wiring board, and a ground plane plated on a first side and in electrical communication with selected ones of the plurality of ground plated-through-holes and defining a signal-to-ground ratio for the printed wiring boards. Printed wiring boards described herein with plating patterns in accordance with the invention are versatile and ensure high electrical integrity by modifying the signal-to-ground ratio of the printed wiring boards and enabling higher density of contact pads.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CURRENT COLLECTORS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | Printed wiring boards having low signal-to-ground ratios |
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