Polyamino oligomers and polymaleimide compounds
PCT No. PCT/JP92/01030 Sec. 371 Date Jun. 2, 1993 Sec. 102(e) Date Jun. 2, 1993 PCT Filed Aug. 12, 1992 PCT Pub. No. WO93/12933 PCT Pub. Date Jul. 8, 1993.The polyamino oligomers of this invention are obtained by reacting diisopropenylbenzenes or bis( alpha -hydroxyisopropyl)benzenes and anilines in...
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| creator | KAMIO KUNIMASA UEDA YOUICHI NAITOH SHIGEKI ENDO YASUHIRO |
| description | PCT No. PCT/JP92/01030 Sec. 371 Date Jun. 2, 1993 Sec. 102(e) Date Jun. 2, 1993 PCT Filed Aug. 12, 1992 PCT Pub. No. WO93/12933 PCT Pub. Date Jul. 8, 1993.The polyamino oligomers of this invention are obtained by reacting diisopropenylbenzenes or bis( alpha -hydroxyisopropyl)benzenes and anilines in the presence of an acid catalyst and characterized by the recurring unit having an indane skeleton. These polyamino oligomers can be used as curing agent for laminate resins. Also, they can be reacted with maleic anhydride to prepare polymaleimide compounds of this invention. The polymaleimide compounds of this invention are low in melting point (or softening point) and, in combination with a substance producing three-dimensional crosslinkage such as triallyl isocyanurate, aromatic diamine, etc., can provide thermosetting resin compositions suited for producing copper-clad laminates. The copper-clad laminates obtained from the thermosetting resin compositions of this invention are low in dielectric constant, heat-resistant and also low in water absorptivity, so that they are useful for multi-layer printed boards. |
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No. WO93/12933 PCT Pub. Date Jul. 8, 1993.The polyamino oligomers of this invention are obtained by reacting diisopropenylbenzenes or bis( alpha -hydroxyisopropyl)benzenes and anilines in the presence of an acid catalyst and characterized by the recurring unit having an indane skeleton. These polyamino oligomers can be used as curing agent for laminate resins. Also, they can be reacted with maleic anhydride to prepare polymaleimide compounds of this invention. The polymaleimide compounds of this invention are low in melting point (or softening point) and, in combination with a substance producing three-dimensional crosslinkage such as triallyl isocyanurate, aromatic diamine, etc., can provide thermosetting resin compositions suited for producing copper-clad laminates. The copper-clad laminates obtained from the thermosetting resin compositions of this invention are low in dielectric constant, heat-resistant and also low in water absorptivity, so that they are useful for multi-layer printed boards.</description><edition>6</edition><language>eng</language><subject>ACYCLIC OR CARBOCYCLIC COMPOUNDS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; HETEROCYCLIC COMPOUNDS ; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; ORGANIC CHEMISTRY ; ORGANIC MACROMOLECULAR COMPOUNDS ; PRINTED CIRCUITS ; THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><creationdate>1995</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19950321&DB=EPODOC&CC=US&NR=5399715A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19950321&DB=EPODOC&CC=US&NR=5399715A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KAMIO; KUNIMASA</creatorcontrib><creatorcontrib>UEDA; YOUICHI</creatorcontrib><creatorcontrib>NAITOH; SHIGEKI</creatorcontrib><creatorcontrib>ENDO; YASUHIRO</creatorcontrib><title>Polyamino oligomers and polymaleimide compounds</title><description>PCT No. PCT/JP92/01030 Sec. 371 Date Jun. 2, 1993 Sec. 102(e) Date Jun. 2, 1993 PCT Filed Aug. 12, 1992 PCT Pub. No. WO93/12933 PCT Pub. Date Jul. 8, 1993.The polyamino oligomers of this invention are obtained by reacting diisopropenylbenzenes or bis( alpha -hydroxyisopropyl)benzenes and anilines in the presence of an acid catalyst and characterized by the recurring unit having an indane skeleton. These polyamino oligomers can be used as curing agent for laminate resins. Also, they can be reacted with maleic anhydride to prepare polymaleimide compounds of this invention. The polymaleimide compounds of this invention are low in melting point (or softening point) and, in combination with a substance producing three-dimensional crosslinkage such as triallyl isocyanurate, aromatic diamine, etc., can provide thermosetting resin compositions suited for producing copper-clad laminates. 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No. WO93/12933 PCT Pub. Date Jul. 8, 1993.The polyamino oligomers of this invention are obtained by reacting diisopropenylbenzenes or bis( alpha -hydroxyisopropyl)benzenes and anilines in the presence of an acid catalyst and characterized by the recurring unit having an indane skeleton. These polyamino oligomers can be used as curing agent for laminate resins. Also, they can be reacted with maleic anhydride to prepare polymaleimide compounds of this invention. The polymaleimide compounds of this invention are low in melting point (or softening point) and, in combination with a substance producing three-dimensional crosslinkage such as triallyl isocyanurate, aromatic diamine, etc., can provide thermosetting resin compositions suited for producing copper-clad laminates. 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| subjects | ACYCLIC OR CARBOCYCLIC COMPOUNDS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HETEROCYCLIC COMPOUNDS MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC CHEMISTRY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP |
| title | Polyamino oligomers and polymaleimide compounds |
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