Process for producing copper-clad base materials
PCT No. PCT/EP91/02130 Sec. 371 Date May 19, 1993 Sec. 102(e) Date May 19, 1993 PCT Filed Nov. 11, 1991 PCT Pub. No. WO92/09186 PCT Pub. Date May 29, 1992.In a process known per se for producing base materials copper-clad on at least one side, in which a winding core carrying a copper foil is wound...
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| creator | VOSS BURKHARD FASBENDER HELMUT |
| description | PCT No. PCT/EP91/02130 Sec. 371 Date May 19, 1993 Sec. 102(e) Date May 19, 1993 PCT Filed Nov. 11, 1991 PCT Pub. No. WO92/09186 PCT Pub. Date May 29, 1992.In a process known per se for producing base materials copper-clad on at least one side, in which a winding core carrying a copper foil is wound with a reinforcing fiber, the laid fibers are impregnated with a solvent-free resin and the resin is cured fully to reach the C-stage, it is proposed to use, as the resin, a solvent-free epoxy-isocyanurate resin having a viscosity at processing temperature of less than 1000 mPa.s and an NCO content of more than 20%. |
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Date May 29, 1992.In a process known per se for producing base materials copper-clad on at least one side, in which a winding core carrying a copper foil is wound with a reinforcing fiber, the laid fibers are impregnated with a solvent-free resin and the resin is cured fully to reach the C-stage, it is proposed to use, as the resin, a solvent-free epoxy-isocyanurate resin having a viscosity at processing temperature of less than 1000 mPa.s and an NCO content of more than 20%.</description><edition>6</edition><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>1995</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19950228&DB=EPODOC&CC=US&NR=5393591A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19950228&DB=EPODOC&CC=US&NR=5393591A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>VOSS; BURKHARD</creatorcontrib><creatorcontrib>FASBENDER; HELMUT</creatorcontrib><title>Process for producing copper-clad base materials</title><description>PCT No. PCT/EP91/02130 Sec. 371 Date May 19, 1993 Sec. 102(e) Date May 19, 1993 PCT Filed Nov. 11, 1991 PCT Pub. 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No. WO92/09186 PCT Pub. Date May 29, 1992.In a process known per se for producing base materials copper-clad on at least one side, in which a winding core carrying a copper foil is wound with a reinforcing fiber, the laid fibers are impregnated with a solvent-free resin and the resin is cured fully to reach the C-stage, it is proposed to use, as the resin, a solvent-free epoxy-isocyanurate resin having a viscosity at processing temperature of less than 1000 mPa.s and an NCO content of more than 20%.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record> |
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| title | Process for producing copper-clad base materials |
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