Process for producing copper-clad base materials

Process for producing copper-clad base materials

PCT No. PCT/EP91/02130 Sec. 371 Date May 19, 1993 Sec. 102(e) Date May 19, 1993 PCT Filed Nov. 11, 1991 PCT Pub. No. WO92/09186 PCT Pub. Date May 29, 1992.In a process known per se for producing base materials copper-clad on at least one side, in which a winding core carrying a copper foil is wound...

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Bibliographische Detailangaben
Hauptverfasser: VOSS, BURKHARD, FASBENDER, HELMUT
Format: Patent
Sprache:eng
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
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Zusammenfassung:PCT No. PCT/EP91/02130 Sec. 371 Date May 19, 1993 Sec. 102(e) Date May 19, 1993 PCT Filed Nov. 11, 1991 PCT Pub. No. WO92/09186 PCT Pub. Date May 29, 1992.In a process known per se for producing base materials copper-clad on at least one side, in which a winding core carrying a copper foil is wound with a reinforcing fiber, the laid fibers are impregnated with a solvent-free resin and the resin is cured fully to reach the C-stage, it is proposed to use, as the resin, a solvent-free epoxy-isocyanurate resin having a viscosity at processing temperature of less than 1000 mPa.s and an NCO content of more than 20%.