Cooling multi-chip modules using embedded heat pipes

A method and apparatus is disclosed for cooling a multi-chip module using embedded heat pipes. Semiconductor chips are disposed into the multi-chip module through cavities in the module substrate. The semiconductor chips engage heat pipes embedded within the substrate. The heat pipes conduct heat aw...

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Hauptverfasser:	CONTE, ALFRED S
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT HEATING LIGHTING MECHANICAL ENGINEERING SEMICONDUCTOR DEVICES WEAPONS
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creator	CONTE ALFRED S
description	A method and apparatus is disclosed for cooling a multi-chip module using embedded heat pipes. Semiconductor chips are disposed into the multi-chip module through cavities in the module substrate. The semiconductor chips engage heat pipes embedded within the substrate. The heat pipes conduct heat away from the semiconductor chips through a heat conductive bonding layer.
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The semiconductor chips engage heat pipes embedded within the substrate. 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Semiconductor chips are disposed into the multi-chip module through cavities in the module substrate. The semiconductor chips engage heat pipes embedded within the substrate. 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subjects	BASIC ELECTRIC ELEMENTS BLASTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT HEATING LIGHTING MECHANICAL ENGINEERING SEMICONDUCTOR DEVICES WEAPONS
title	Cooling multi-chip modules using embedded heat pipes
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