Denuding a semiconductor substrate

A semiconductor substrate is denuded using a reducing gas mixture including carbon monoxide and carbon dioxide. Use of the reducing gas mixture allows very low oxygen partial pressure to be achieved in a furnace tube during the step of denuding. Oxygen partial pressure lower than 1E-9 atmosphere may...

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Bibliographische Detailangaben
Hauptverfasser: TOBIN, PHILIP J, LIMB, YOUNG
Format: Patent
Sprache:eng
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